Electronic device including antenna device

ABSTRACT

An electronic device is provided. The electronic device includes a first housing structure including a first side surface member, a second housing structure including a second side surface member, a hinge structure configured to rotatably connect the first housing structure and the second housing structure and configured to provide a folding axis on which the first housing structure and the second housing structure rotate, and at least one printed circuit board, wherein the first side surface member or the second side surface member includes a first side surface portion a second side surface portion, a third side surface portion, a fourth side surface portion, a fifth side surface portion, a first slit a second slit a third slit, and a fourth slit, and a fifth slit, and wherein at least part of at least one of the second side surface portion, the third side surface portion, and the fourth side surface portion is formed of a radiation conductor and is electrically connected to the at least one printed circuit board.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of prior application Ser.No. 16/794,859, filed on Feb. 19, 2020, and is based on and claimspriority under 35 U.S.C. § 119(a) of a Korean patent application number10-2019-0019551, filed on Feb. 19, 2019, in the Korean IntellectualProperty Office, and of a Korean patent application number10-2019-0078718, filed on Jul. 1, 2019, in the Korean IntellectualProperty Office, the disclosure of each of which is incorporated byreference herein in its entirety.

BACKGROUND 1. Field

The disclosure relates to electronic devices with an antenna device.

2. Description of Related Art

Developing electronic information communication technology integratesvarious functionalities into a single electronic device. For example,smartphones pack the functionalities of a sound player, imaging device,and scheduler, as well as the communication functionality and, on top ofthat, may implement more various functions by having applicationsinstalled thereon.

The user of an electronic device may search, screen, and obtain moreinformation by accessing a network, but rather than simply using thefunctionalities or information (e.g., applications) of the electronicdevice. Direct access to the network (e.g., wired communication) mayenable quick and stable communication establishment but its usabilitymay be limited to a fixed location or space. Wireless network access isless limited in location or space, delivers such a level of speed andstability as approaches those of direct network access, and is expectedto be able to establish communication faster and more stable than directnetwork access.

As smartphones or other personal/portable communication devices spread,users' demand for portability and use convenience is on the rise. Forexample, foldable or rollable electronic devices may be easy to carryand deliver an enhanced multimedia environment, with their largerscreen.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

It may be hard to secure communication environments in differentfrequency bands in a compact electronic device. For example, anindependent operation environment (e.g., a sufficient space) needs to beprovided for each antenna, but this may be impossible to attain in sucha small electronic device. Foldable or rollable electronic devices havea further shrunken structure or space for placing antennas. The housingis thinned down for more flexibility and thus fails to provide a spacelarge enough to arrange antennas. In an embodiment, a foldable orrollable electronic device may experience a change in the operationenvironment of the antenna when rolled or folded. For example, thearrangement of structures around the antenna may be altered in thefolded or rolled state, and so is the operation performance of theantenna.

Aspects of the disclosure are to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below. Accordingly, an aspect of the disclosure is to providean electronic device with an antenna device, which delivers a stableoperation performance even when the structures are folded or rolled.

Another aspect of the disclosure is to provide an electronic device withan antenna device, which may be easily equipped in a slim, compactstructure and deliver a stable operation performance.

Another aspect of the disclosure is to provide an electronic device witha plurality of first and second connection members for electricalconnection between a switching unit and each radiation conductor (e.g.,antennas) arranged in structures.

Another aspect of the disclosure is to provide an electronic device withan antenna device, which delivers a stable operation performanceaccording to a hand grip on the structures in the folded or unfoldedstate of the structures.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, an electronic devicewith an antenna device is provided. The electronic device includes afirst housing structure including a first surface facing in a firstdirection, a second surface facing in a second direction opposite to thefirst direction, and a first side surface member at least partiallysurrounding a space between the first surface and the second surface,the first housing structure at least partially formed of an electricallyconductive material; a second housing structure including a thirdsurface facing in a third direction, a fourth surface facing in a fourthdirection opposite to the third direction, and a second side surfacemember at least partially surrounding a space between the third surfaceand the fourth surface, the second housing structure at least partiallyformed of an electrically conductive material; a hinge structureconfigured to rotatably connect the first housing structure and thesecond housing structure and provide a folding axis on which the firsthousing structure and the second housing structure rotate; and at leastone printed circuit board disposed between the first surface and thesecond surface or between the third surface and the fourth surface. Thefirst side surface member and the second side surface member includes afirst side surface portion disposed in parallel with the folding axis, asecond side surface portion extending from an end of the first sidesurface portion in a direction crossing the folding axis, a third sidesurface portion extending from another end of the first side surfaceportion in parallel with the folding axis, a fourth side surface portionconnected with the third side surface portion and extending from thethird side surface portion in a direction crossing the folding axis, afifth side surface portion connecting the second side surface portionand the fourth side surface portion and extending in parallel with thefolding axis, the fifth side surface portion disposed adjacent to thehinge structure, a first slit formed between an end of the first sidesurface portion and the second side surface portion, a second slitformed between the second side surface portion and the fifth sidesurface portion, a third slit formed between another end of the firstside surface portion and the third side surface portion, and a fourthslit formed between the third side surface portion and the fourth sidesurface portion, and a fifth slit formed between the fourth side surfaceportion and the fifth side surface portion. At least part of at leastone of the second side surface portion, the third side surface portion,and the fourth side surface portion is formed of a radiation conductorand is electrically connected to the printed circuit board.

In accordance with another aspect of the disclosure, an electronicdevice with an antenna device is provided. The electronic deviceincludes a first housing structure including a first surface facing in afirst direction, a second surface facing in a second direction oppositeto the first direction, and a first side surface member at leastpartially surrounding a space between the first surface and the secondsurface, the first housing structure at least partially formed of anelectrically conductive material; a second housing structure including athird surface facing in a third direction, a fourth surface facing in afourth direction opposite to the third direction, and a second sidesurface member at least partially surrounding a space between the thirdsurface and the fourth surface, the second housing structure at leastpartially formed of an electrically conductive material; a hingestructure configured to rotatably connect the first housing structureand the second housing structure and provide a folding axis on which thefirst housing structure and the second housing structure rotate; and atleast one printed circuit board disposed between the first surface andthe second surface or between the third surface and the fourth surface.The first side surface member includes a first side surface portiondisposed in parallel with the folding axis; a second side surfaceportion extending from an end of the first side surface portion in adirection crossing the folding axis; a third side surface portionextending from another end of the first side surface portion in parallelwith the folding axis; a fourth side surface portion connected with thethird side surface portion and extending from the third side surfaceportion in a direction crossing the folding axis; a fifth side surfaceportion connecting the second side surface portion and the fourth sidesurface portion and extending in parallel with the folding axis, thefifth side surface portion disposed adjacent to the hinge structure; afirst slit formed between an end of the first side surface portion andthe second side surface portion; a second slit formed between the secondside surface portion and the fifth side surface portion; a third slitformed between another end of the first side surface portion and thethird side surface portion; a fourth slit formed between the third sidesurface portion and the fourth side surface portion; and a fifth slitformed between the fourth side surface portion and the fifth sidesurface portion. The second side surface member includes a sixth sidesurface portion disposed in parallel with the folding axis; a seventhside surface portion extending from an end of the sixth side surfaceportion in a direction crossing the folding axis; an eighth side surfaceportion extending from another end of the sixth side surface portion inparallel with the folding axis; a ninth side surface portion connectedwith the eighth side surface portion and extending from the eighth sidesurface portion in a direction crossing the folding axis; a tenth sidesurface portion connecting the seventh side surface portion and theninth side surface portion and extending in parallel with the foldingaxis, the tenth side surface portion disposed adjacent to the hingestructure; a sixth slit formed between an end of the sixth side surfaceportion and the seventh side surface portion; a seventh slit formedbetween the seventh side surface portion and the tenth side surfaceportion; an eighth slit formed between another end of the sixth sidesurface portion and the eighth side surface portion; a ninth slit formedbetween the eighth side surface portion and the ninth side surfaceportion; and a tenth slit formed between the ninth side surface portionand the tenth side surface portion. At least part of at least one of thesecond side surface portion, the third side surface portion, and thefourth side surface portion is formed of a radiation conductor providedas an antenna and is electrically connected to the printed circuitboard, and at least part of at least one of the seventh side surfaceportion, the eighth side surface portion, and the ninth side surfaceportion is formed of a radiation conductor provided as an antenna and iselectrically connected to the printed circuit board.

In accordance with another aspect of the disclosure, an electronicdevice with an antenna device is provided. The electronic deviceincludes a first housing structure including a first side surfacemember, a second housing structure including a second side surfacemember, and a hinge structure rotatably connecting the first housingstructure and the second housing structure and providing a folding axison which the first housing structure and the second housing structurerotate. The first side surface member includes at least one firstradiation conductor and at least one second radiation conductor. Thesecond side surface member includes at least one third radiationconductor and at least one fourth radiation conductor. A plurality offirst connection members are disposed in at least part of the firsthousing structure to electrically connect the at least one firstradiation conductor and the at least one second radiation conductor witha switching unit disposed in the first housing structure, and aplurality of second connection members are disposed in at least part ofthe first and second housing structures and at least part of the hingestructure to electrically connect the at least one third radiationconductor and the at least one fourth radiation conductor with theswitching unit.

According to various embodiments, in an electronic device with anantenna device, at least part of a first and second side surface memberof the electronic device may be formed of a radiation conductor providedas an antenna. Thus, a stable operation performance (e.g., radiationefficiency) may be achieved in the unfolded state of the electronicdevice. Further, when the user makes a call with the electronic devicein his hand (e.g., hand grip), deterioration of the radiationperformance due to the user's body may be reduced. For example, even inthe folded state of the electronic device, the radiation conductorsformed in the first and second side surface members are exposed from theside surfaces of the electronic device to the external space, allowingthe radiation conductors to stably transmit/receive radio waves. Asanother example, the radiation conductor may implement at least part ofthe first and second side surface member as an antenna, enabling easierplacement even in a slim, compact structure.

According to various embodiments, in the unfolded state or folded stateof the first and second housing structures in the plurality of housingsand hinge structure supporting one display, a plurality of first andsecond connection members (e.g., coaxial cables, flexible printedcircuit boards (FPCBs), micro strip lines, or strip lines) forconnecting at least one first to fourth radiation conductor and aswitching unit included in the electronic device are formed, providing abetter electrical connection between the switching unit and the at leastone first to fourth radiation conductor and hence enhancing the antennafunction of the at least one first to fourth radiation conductor.

According to various embodiments, in the folded state or unfolded stateof the first and second housing structures, switching among the first tofourth radiation conductors may be rendered according to the hand gripof the first and second housing structures, enabling stabletransmission/reception and resultantly allowing the antenna devicestable radiation performance.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a block diagram illustrating an electronic device in a networkenvironment according to an embodiment of the disclosure;

FIG. 2 is a view illustrating an electronic device in an unfolded stateaccording to an embodiment of the disclosure;

FIG. 3 is a view illustrating the electronic device of FIG. 2, in afolded state, according to an embodiment of the disclosure;

FIG. 4 is an exploded perspective view illustrating an electronic deviceaccording to an embodiment of the disclosure;

FIG. 5 is a view illustrating a configuration of side surface member(s)in an electronic device according to an embodiment of the disclosure;

FIG. 6 is an enlarged view of portion B of FIG. 5 according to anembodiment of the disclosure;

FIG. 7 is a view illustrating a configuration of an antenna device in anelectronic device according to an embodiment of the disclosure;

FIG. 8 is a perspective view illustrating an electronic device in afolded state according to an embodiment of the disclosure;

FIG. 9 is a plan view illustrating an electronic device in a foldedstate according to an embodiment of the disclosure;

FIG. 10 is a side view illustrating a third slit and an eighth slitamong components of an electronic device in a folded state according toan embodiment of the disclosure;

FIG. 11 is a bottom view illustrating a fourth, fifth, ninth, and tenthslit among components of an electronic device in a folded stateaccording to an embodiment of the disclosure;

FIG. 12 is a view illustrating a configuration of an antenna device inan electronic device according to an embodiment of the disclosure;

FIG. 13 is a view illustrating an electromagnetic field distribution ofan electronic device in a folded state according to an embodiment of thedisclosure;

FIG. 14 is a view illustrating an electromagnetic field distribution ofa display ground of an electronic device in a folded state according toan embodiment of the disclosure;

FIG. 15 is a graph illustrating a radiation pattern measured on anelectronic device according to an embodiment of the disclosure;

FIG. 16A is a view illustrating a first, second, third, and fourthdistance of slots formed in a side surface or bottom of an electronicdevice, with the folded electronic device in the user's hand (e.g., theright hand) according to an embodiment of the disclosure;

FIG. 16B is a view illustrating a fourth distance of a slot formed in aside surface of an electronic device or a first distance of a slotformed in a bottom of the electronic device, with the folded electronicdevice in the user's hand (e.g., the left hand) according to anembodiment of the disclosure;

FIG. 17 is a graph illustrating a radiation efficiency measured on anelectronic device according to an embodiment of the disclosure;

FIG. 18 is a view illustrating a configuration of a first and secondside surface member electrically connected with a switching unit in afirst housing structure of an electronic device using a coaxial cableaccording to an embodiment of the disclosure;

FIG. 19 is a view illustrating a configuration of a first and secondside surface member electrically connected with a switching unit in afirst housing structure of an electronic device using a flexible printedcircuit board according to an embodiment of the disclosure;

FIG. 20 is a view illustrating a configuration of a first and secondside surface member electrically connected with a switching unit in afirst housing structure of an electronic device using a coaxial cableand flexible printed circuit board according to an embodiment of thedisclosure;

FIG. 21 is a view illustrating a hand gripped state of a second housingstructure among components of an electronic device according to anembodiment of the disclosure;

FIG. 22 is a view illustrating a hand gripped state of a first housingstructure among components of an electronic device according to anembodiment of the disclosure; and

FIG. 23 is a view illustrating a hand gripped state of both a first andsecond housing structure among components of an electronic deviceaccording to an embodiment of the disclosure.

Throughout the drawings, it should be noted that like reference numbersare used to depict the same or similar elements, features, andstructures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thedisclosure. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of thedisclosure is provided for illustration purpose only and not for thepurpose of limiting the disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

Various changes may be made to the disclosure, and the disclosure maycome with a diversity of embodiments. Some embodiments of the disclosureare shown and described in connection with the drawings. However, itshould be appreciated that the disclosure is not limited to theembodiments, and all changes and/or equivalents or replacements theretoalso belong to the scope of the disclosure.

With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements. It is tobe understood that a singular form of a noun corresponding to an itemmay include one or more of the things, unless the relevant contextclearly indicates otherwise. As used herein, each of such phrases as “Aor B,” “at least one of A and B,” “at least one of A or B,” “A, B, orC,” “at least one of A, B, and C,” and “at least one of A, B, or C,” mayinclude all possible combinations of the items enumerated together in acorresponding one of the phrases. The terms coming with ordinal numberssuch as ‘first’ and ‘second’ may be used to denote various components,but the components are not limited by the terms. The terms are used todistinguish one component from another. For example, a first componentmay be denoted a second component, and vice versa without departing fromthe scope of the disclosure. The term “and/or” may denote acombination(s) of a plurality of related items as listed or any of theitems. It is to be understood that if an element (e.g., a first element)is referred to, with or without the term “operatively” or“communicatively”, as “coupled with,” “coupled to,” “connected with,” or“connected to” another element (e.g., a second element), it means thatthe element may be coupled with the other element directly (e.g.,wiredly), wirelessly, or via a third element.

The terms “front,” “rear surface,” “upper surface,” and “lower surface”are relative ones that may be varied depending on directions in whichthe figures are viewed, and may be replaced with ordinal numbers such as“first” and “second.” The order denoted by the ordinal numbers, firstand second, may be varied as necessary.

The terms as used herein are provided merely to describe someembodiments thereof, but not to limit the disclosure. As used herein,the singular forms “a,” “an,” and “the” are intended to include theplural forms as well, unless the context clearly indicates otherwise. Itwill be further understood that the terms “comprise” and/or “have,” whenused in this specification, specify the presence of stated features,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof.

Unless otherwise defined, all terms including technical and scientificterms used herein have the same meaning as commonly understood by one ofordinary skill in the art to which the embodiments of the disclosurebelong. It will be further understood that terms, such as those definedin commonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand will not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

As used herein, the term “electronic device” may be any device with atouch panel, and the electronic device may also be referred to as aterminal, a portable terminal, a mobile terminal, a communicationterminal, a portable communication terminal, a portable mobile terminal,or a display apparatus.

For example, the electronic device may be a smartphone, a mobile phone,a navigation device, a game device, a TV, a head unit for vehicles, alaptop computer, a tablet computer, a personal media player (PMP), or apersonal digital assistant (PDA). The electronic device may beimplemented as a pocket-sized portable communication terminal with aradio communication function. According to an embodiment of thedisclosure, the electronic device may be a flexible device or a flexibledisplay.

The electronic device may communicate with an external electronicdevice, e.g., a server, or may perform tasks by interworking with suchan external electronic device. For example, the electronic device maytransmit an image captured by a camera and/or location informationdetected by a sensor to a server through a network. The network mayinclude, but is not limited to, a mobile or cellular communicationnetwork, a local area network (LAN), a wireless local area network(WLAN), a wide area network (WAN), the Internet, or a small area network(SAN).

FIG. 1 is a block diagram illustrating an electronic device 101 in anetwork environment 100 according to an embodiment of the disclosure.

Referring to FIG. 1, the electronic device 101 in the networkenvironment 100 may communicate with an external electronic device 102via a first network 198 (e.g., a short-range wireless communicationnetwork), or an external electronic device 104 or a server 108 via asecond network 199 (e.g., a long-range wireless communication network).According to an embodiment, the electronic device 101 may communicatewith the external electronic device 104 via the server 108. According toan embodiment, the electronic device 101 may include a processor 120,memory 130, an input device 150, a sound output device 155, a displaydevice 160, an audio module 170, a sensor module 176, an interface 177,a haptic module 179, a camera module 180, a power management module 188,a battery 189, a communication module 190, a subscriber identificationmodule (SIM) 196, or an antenna module 197. In some embodiments, atleast one (e.g., the display device 160 or the camera module 180) of thecomponents may be omitted from the electronic device 101, or one or moreother components may be added in the electronic device 101. In someembodiments, some of the components may be implemented as singleintegrated circuitry. For example, the sensor module 176 (e.g., afingerprint sensor, an iris sensor, or an illuminance sensor) may beimplemented as embedded in the display device 160 (e.g., a display).

The processor 120 may execute, e.g., software (e.g., a program 140) tocontrol at least one other component (e.g., a hardware or softwarecomponent) of the electronic device 101 connected with the processor 120and may process or compute various data. According to one embodiment, asat least part of the data processing or computation, the processor 120may load a command or data received from another component (e.g., thesensor module 176 or the communication module 190) in volatile memory132, process the command or the data stored in the volatile memory 132,and store resulting data in non-volatile memory 134. According to anembodiment, the processor 120 may include a main processor 121 (e.g., acentral processing unit (CPU) or an application processor (AP)), and anauxiliary processor 123 (e.g., a graphics processing unit (GPU), animage signal processor (ISP), a sensor hub processor, or a communicationprocessor (CP)) that is operable independently from, or in conjunctionwith, the main processor 121. Additionally or alternatively, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as partof the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one (e.g., the display device 160, the sensormodule 176, or the communication module 190) of the components of theelectronic device 101, instead of the main processor 121 while the mainprocessor 121 is in an inactive (e.g., sleep) state or along with themain processor 121 while the main processor 121 is an active state(e.g., executing an application). According to an embodiment, theauxiliary processor 123 (e.g., an image signal processor or acommunication processor) may be implemented as part of another component(e.g., the camera module 180 or the communication module 190)functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input device 150 may receive a command or data to be used by anothercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputdevice 150 may include, for example, a microphone, a mouse, a keyboard,or a digital pen (e.g., a stylus pen).

The sound output device 155 may output sound signals to the outside ofthe electronic device 101. The sound output device 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record, and the receivermay be used for incoming calls. According to an embodiment, the receivermay be implemented as separate from, or as part of the speaker.

The display device 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display device 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the displays,hologram device, and projector. According to an embodiment, the displaydevice 160 may include touch circuitry adapted to detect a touch, orsensor circuitry (e.g., a pressure sensor) adapted to measure theintensity of force incurred by the touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtaina sound through the input device 150 or output a sound through the soundoutput device 155 or an external electronic device (e.g., an externalelectronic device 102 (e.g., a speaker or a headphone) directly orwirelessly connected with the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the external electronic device 102) directly (e.g.,wiredly) or wirelessly. According to an embodiment, the interface 177may include, for example, a high definition multimedia interface (HDMI),a universal serial bus (USB) interface, a secure digital (SD) cardinterface, or an audio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the external electronic device 102). Accordingto an embodiment, the connecting terminal 178 may include, for example,a HDMI connector, a USB connector, a SD card connector, or an audioconnector (e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or motion) or electrical stimulus which maybe recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to one embodiment, the power managementmodule 388 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or wireless communication channel betweenthe electronic device 101 and an external electronic device (e.g., theexternal electronic device 102, the external electronic device 104, orthe server 108) and performing communication through the establishedcommunication channel. The communication module 190 may include one ormore communication processors that are operable independently from theprocessor 120 (e.g., the application processor (AP)) and supports adirect (e.g., wired) communication or a wireless communication.According to an embodiment, the communication module 190 may include awireless communication module 192 (e.g., a cellular communicationmodule, a short-range wireless communication module, or a globalnavigation satellite system (GNSS) communication module) or a wiredcommunication module 194 (e.g., a local area network (LAN) communicationmodule or a power line communication (PLC) module). A corresponding oneof these communication modules may communicate with the externalelectronic device via the first network 198 (e.g., a short-rangecommunication network, such as Bluetooth™, wireless-fidelity (Wi-Fi)direct, or infrared data association (IrDA)) or the second network 199(e.g., a long-range communication network, such as a cellular network,the Internet, or a computer network (e.g., LAN or wide area network(WAN)). These various types of communication modules may be implementedas a single component (e.g., a single chip), or may be implemented asmulti components (e.g., multi chips) separate from each other. Thewireless communication module 192 may identify and authenticate theelectronic device 101 in a communication network, such as the firstnetwork 198 or the second network 199, using subscriber information(e.g., international mobile subscriber identity (IMSI)) stored in thesubscriber identification module 196.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna modulemay include one antenna including a radiator formed of a conductor orconductive pattern formed on a substrate (e.g., a printed circuit board(PCB)). According to an embodiment, the antenna module 197 may include aplurality of antennas. In this case, at least one antenna appropriatefor a communication scheme used in a communication network, such as thefirst network 198 or the second network 199, may be selected from theplurality of antennas by, e.g., the communication module 190. The signalor the power may then be transmitted or received between thecommunication module 190 and the external electronic device via theselected at least one antenna. According to an embodiment, other parts(e.g., radio frequency integrated circuit (RFIC)) than the radiator maybe further formed as part of the antenna module 197.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Thefirst and second external electronic devices 102 and 104 each may be adevice of the same or a different type from the electronic device 101.According to an embodiment, all or some of operations to be executed atthe electronic device 101 may be executed at one or more of the externalelectronic devices 102, 104, or 108. For example, if the electronicdevice 101 should perform a function or a service automatically, or inresponse to a request from a user or another device, the electronicdevice 101, instead of, or in addition to, executing the function or theservice, may request the one or more external electronic devices toperform at least part of the function or the service. The one or moreexternal electronic devices receiving the request may perform the atleast part of the function or the service requested, or an additionalfunction or an additional service related to the request, and transferan outcome of the performing to the electronic device 101. Theelectronic device 101 may provide the outcome, with or without furtherprocessing of the outcome, as at least part of a reply to the request.To that end, a cloud computing, distributed computing, or client-servercomputing technology may be used, for example.

FIG. 2 is a view illustrating an electronic device 200 in an unfoldedstate according to an embodiment of the disclosure.

FIG. 3 is a view illustrating the electronic device 200 of FIG. 2, in afolded state, according to an embodiment of the disclosure.

The electronic device 200 of FIGS. 2 and 3 may be at least partiallysimilar to the electronic device 101 of FIG. 1 or may include otherfeatures.

Referring to FIG. 2, an electronic device 200 may include a pair ofhousing structures 210 and 220 coupled together via a hinge structure(e.g., the hinge structure 264 of FIG. 4) to be rotatable to fold toeach other, a hinge cover 265 covering foldable portions of the pair ofhousing structures 210 and 220, and a display 230 (e.g., a flexibledisplay or foldable display) disposed in a space formed by the pair ofhousing structures 210 and 220. According to an embodiment, the hingecover 265 may be part of the hinge structure 264. According to anembodiment, the electronic device 200 may include a foldable housingrotatably coupled from the position in which the pair of housingstructures 210 and 220 are folded to face each other to the position inwhich the pair of housing structures 210 and 220 are positioned side byside. In the disclosure, the surface where the display 230 is in may bedefined as a ‘front surface’ of the electronic device 200, and itsopposite surface may be defined as a ‘back surface’ of the electronicdevice 200. The surface surrounding the space between the front and backsurfaces may be defined as a ‘side surface’ of the electronic device200.

According to an embodiment, the pair of housing structures 210 and 220may include a first housing structure 210 with a sensor area 231 d, asecond housing structure 220, a first back cover 240, and a second backcover 250. The pair of housing structures 210 and 220 of the electronicdevice 200 are not limited to the shape and coupling shown in FIGS. 2and 3 but may rather be implemented in other shapes or via a combinationand/or coupling of other components. For example, the first housingstructure 210 and the first back cover 240 may be integrally formed witheach other, and the second housing structure 220 and the second backcover 250 may be integrally formed with each other.

According to an embodiment, the first housing structure 210 and thesecond housing structure 220 may be positioned on opposite sides of afirst axis, e.g., a folding axis A, and they may be overall symmetricalin shape with each other with respect to the folding axis A. Accordingto an embodiment, the first housing structure 210 and the second housingstructure 220 may be rotated on the hinge structure 264 or hinge cover265 with respect to different folding axes. For example, the firsthousing structure 210 and the second housing structure 220 each may berotatably coupled to the hinge structure 264 or the hinge cover 265, andthe first housing structure 210 and the second housing structure 220 maybe rotated on the folding axis A or different folding axes from theposition where they are folded together to the position where they areinclined or positioned side-by-side with respect to each other.

As used herein, when A and B are positioned or extend side-by-side, itmay mean that A and B are positioned at least partially next to eachother or at least partially in parallel with each other. According to anembodiment, when A and B are disposed (or arranged) side-by-side, it maymean that A and B are disposed (or arranged) to face in the samedirection or directions parallel with each other. In the followingdescription, although the example phrases “side-by-side” and “inparallel with each other” may be used to describe the correspondingstructures, the shape or arrangement of the structures may easily beappreciated from the accompanying drawings.

According to an embodiment, the first housing structure 210 and thesecond housing structure 220 may form different angles or distancesdepending on whether the electronic device 200 is in an unfolded state(or flat state, or open state) or folded state (or folding state), or ina state therebetween. According to an embodiment, the first housingstructure 210 and the second housing structure 220 may be symmetrical inshape except that the first housing structure 210 further includes asensor area 231 d where various sensors are arranged. Alternatively, thesensor area 231 d may be disposed in at least a portion of the secondhousing structure 220, not the first housing structure 210, or anothersensor area may be included in the second housing structure 220.

According to an embodiment, in the unfolded state of the electronicdevice 200, the first housing structure 210 may be connected to thehinge structure (e.g., the hinge structure 264 of FIG. 4) and mayinclude a first surface 211 disposed to face the front surface of theelectronic device 200, a second surface 212 facing away from the firstsurface 211, and a first side surface member 213 surrounding at least aportion of the space between the first surface 211 and the secondsurface 212. According to an embodiment, the first side surface member213 may include a first side surface 213 a disposed in parallel with thefolding axis A, a second side surface 213 b extending from one end ofthe first side surface 213 a in a direction perpendicular to the foldingaxis A, and a third side surface 213 c extending from the other end ofthe first side surface 213 a in a direction perpendicular to the foldingaxis A. As used herein, the term “perpendicular” or “parallel” may beinterchangeably used with “partially perpendicular” or “partiallyparallel.” In some embodiments, “parallel” or “perpendicular” may alsomean “inclined in an angle range within 10 degrees.”

According to an embodiment, the second housing structure 220 may beconnected to the hinge structure (e.g., the hinge structure 264 of FIG.4) and, in the unfolded state of the electronic device 200, the secondhousing structure 220 may include a third surface 221 disposed to facethe front surface of the electronic device 200, a fourth surface 222facing away from the third surface 221, and a second side surface member223 surrounding at least a portion of the space between the thirdsurface 221 and the fourth surface 222. According to an embodiment, thesecond side surface member 223 may include a fourth side surface 223 adisposed in parallel with the folding axis A, a fifth side surface 223 bextending from one end of the fourth side surface 223 a in a directionperpendicular to the folding axis A, and a sixth side surface 223 cextending from the other end of the fourth side surface 223 a in adirection perpendicular to the folding axis A. According to anembodiment, the third surface 221, in the folded state, may be disposedto face the first surface 211. According to an embodiment, the secondside surface member 223 may be formed in substantially the same shape ormaterial as the first side surface member 213 although they maypartially differ in their specific shapes.

According to an embodiment, the electronic device 200 may include arecess 201 to receive the display 230 via a structural shape combinationof the first housing structure 210 and the second housing structure 220.The recess 201 may have substantially the same size as the display 230.According to an embodiment, due to the sensor area 231 d, the recess 201may have two or more different widths in the direction perpendicular tothe folding axis A. For example, the recess 201 may have a first widthW1 between a first portion 220 a, parallel with the folding axis A, ofthe second housing structure 220, and a first portion 210 a, formed atan edge of the sensor area 231 d, of the first housing structure 210 anda second width W2 formed by a second portion 220 b of the second housingstructure 210 and a second portion 210 b, which is parallel with thefolding axis A and does not correspond to the sensor area 231 d, of thefirst housing structure 210. In this case, the second width W2 may belarger than the first width W1. For example, the recess 201 may beformed with the first width W1 between the first portion 210 a of thefirst housing structure 210 and the first portion 220 a of the secondhousing structure 220, which are asymmetrical in shape with each other,and the second width W1 between the second portion 210 b of the firsthousing structure 210 and the second portion 220 b of the second housingstructure 220, which are symmetrical in shape with each other. Accordingto an embodiment, the first portion 210 a and second portion 210 b ofthe first housing structure 210 may be formed to have differentdistances from the folding axis A. The width of the recess 201 is notlimited thereto. According to an embodiment, the recess 201 may have twoor more different widths depending on the shape of the sensor area 231 dor the asymmetrical shape portions of the first housing structure 210and the second housing structure 220.

According to an embodiment, the first housing structure 210 and thesecond housing structure 220 may at least partially be formed of a metalor non-metallic material with a rigidity selected to support the display230. According to an embodiment, the first housing structure 210 and thesecond housing structure 220 may at least partially include anelectrically conductive material. When the first housing structure 210and the second housing structure 220 include an electrically conductivematerial, the electronic device 200 may transmit/receive radio waves viathe electrically conductive portions of the first housing structure 210and the second housing structure 220. For example, the processor (e.g.,the processor 120 of FIG. 1) or communication module (e.g., thecommunication module 190) of the electronic device 200 may performwireless communication using a portion of the first housing structure210 and the second housing structure 220.

According to an embodiment, the sensor area 231 d may be formed adjacentto one corner of the first housing structure 210 and to have apredetermined area. However, the placement, shape, or size of the sensorarea 231 d is not limited to that shown in the drawings. For example,according to an embodiment, the sensor area 231 d may be provided in adifferent corner of the first housing structure 210 or in any areabetween the top corner and the bottom corner. According to anembodiment, the sensor area 231 d may be disposed in at least an area ofthe second housing structure 220. According to an embodiment, the sensorarea 231 d may be disposed to extend to the first housing structure 210and the second housing structure 220. According to an embodiment, theelectronic device 200 may include components exposed from its frontsurface through the sensor area 231 d or one or more openings preparedin the sensor area 231 d and may perform various functions by way of thecomponents. The components arranged in the sensor area 231 d may includeat least one of, e.g., a front camera device (e.g., the camera module180 of FIG. 1), a receiver (e.g., the audio module 170 of FIG. 1), aproximity sensor, an illuminance sensor, an iris recognition sensor, anultrasonic sensor (e.g., the sensor module 176 of FIG. 1), or anindicator.

According to an embodiment, the first back cover 240 may be disposed onthe second surface 212 of the first housing structure 210 and may have asubstantially rectangular periphery. According to an embodiment, theperiphery of the first back cover 240 may be at least partiallysurrounded by the first housing structure 210. Similarly, the secondback cover 250 may be disposed on the fourth surface 222 of the secondhousing structure 220 and its periphery may be at least partiallysurrounded by the second housing structure 220.

In the shown embodiment, the first back cover 240 and the second backcover 250 may be substantially symmetrical in shape with respect to thefolding axis A. According to an embodiment, the first back cover 240 andthe second back cover 250 may have other various different shapes.According to an embodiment, the first back cover 240 may be integrallyformed with the first housing structure 210, and the second back cover250 may be integrally formed with the second housing structure 220.

According to an embodiment, a combined structure of the first back cover240, the second back cover 250, the first housing structure 210, and thesecond housing structure 220 may provide a space where variouscomponents (e.g., a printed circuit board, antenna module, sensormodule, or battery) of the electronic device 200 may be arranged.According to an embodiment, one or more components may be arranged orvisually exposed on/through the back surface of the electronic device200. For example, one or more components or sensors may be visuallyexposed through a first back surface area 241 of the first back cover240. According to an embodiment, the sensor may include a proximitysensor, a rear camera device, and/or flash. According to an embodiment,a sub display 252 may be at least visually exposed through a second backsurface area 251 of the second back cover 250.

The display 230 may be disposed in a space formed by the pair of housingstructures 210 and 220. For example, the display 230 may be seated in arecess (e.g., the recess 201 of FIG. 2) formed by the pair of housingstructures 210 and 220, and the display 230 may be disposed to occupysubstantially most of the front surface of the electronic device 200.For example, the front surface of the electronic device 200 may includethe display 230, a partial area (e.g., an edge area) of the firsthousing structure 210, which is adjacent to the display 230, and apartial area (e.g., an edge area) of the second housing structure 220.According to an embodiment, the back surface of the electronic device200 may include the first back cover 240, a partial area (e.g., an edgearea) of the first housing structure 210, which is adjacent to the firstback cover 240, the second back cover 250, and a partial area (e.g., anedge area) of the second housing structure 220, which is adjacent to thesecond back cover 250.

According to an embodiment, the display 230 may mean a display at leasta portion of which may be transformed to be flat or curved. According toan embodiment, the display 230 may include a folding area 231 c, a firstarea 231 a disposed on one side of the folding area 231 c (e.g., aright-hand area of the folding area 231 c), and a second area 231 bdisposed on the opposite side of the folding area 231 c (e.g., aleft-hand area of the folding area 231 c). For example, the first area231 a may be disposed on the first surface 211 of the first housingstructure 210, and the second area 231 b may be disposed on the thirdsurface 221 of the second housing structure 220. For example, thedisplay 230 may extend from the first surface 211 through the hingestructure 264 of FIG. 3 to the third surface, and its area (e.g., thefolding area 231 c) corresponding to, at least, the hinge structure maybe a flexible area that may transform from flat to curved.

According to an embodiment, the segmentation of the display 230 ismerely an example, and the display 230 may be divided into a pluralityof (e.g., four or more or two) areas depending on the structure orfunction of the display 230. As an example, in the embodiment shown inFIG. 2, the folding area 231 c may extend in the vertical axis (e.g.,the Y axis of FIG. 4) parallel with the folding axis A, and the area ofthe display 230 may be divided by the folding area 231 c or the foldingaxis A. In another embodiment, the area of the display 230 may bedivided by another folding portion (e.g., a folding area parallel withthe horizontal axis (e.g., the X axis of FIG. 4) or another folding axis(e.g., a folding axis parallel with the X axis of FIG. 4). Theabove-described area segmentation is merely physical segmentation by thepair of housing structures 210 and 220 and hinge structure (e.g., thehinge structure 264 of FIG. 4) and, substantially, the display 230 maydisplay a single whole screen via the pair of housing structures 210 and220 and the hinge structure (e.g., the hinge structure 264 of FIG. 4).

According to an embodiment, the first area 231 a and the second area 231b may be overall symmetrical in shape with respect to the folding area231 c. However, unlike the second area 231 b, the first area 231 a mayinclude a notch area (e.g., the notch area 233 of FIG. 4) that providesthe sensor area 231 d and, in the remaining area, be symmetrical inshape with the second area 231 b. For example, the first area 231 a andthe second area 231 b may include symmetrical portions and asymmetricalportions.

Referring to FIG. 3, the hinge cover 265 may be disposed between thefirst housing structure 210 and the second housing structure 220 to hidethe internal components (e.g., the hinge structure 264 of FIG. 4). Forbrevity of description, the hinge cover 265 is provided separately fromthe hinge structure 264 but, as mentioned above, the hinge cover 265 maybe part of the hinge structure 264 while partially forming the outerappearance of the electronic device 200. According to an embodiment, thehinge cover 265 may be hidden by a portion of the first housingstructure 210 and second housing structure 220 or be exposed to theoutside depending on the operation state (e.g., the unfolded state orfolded state) of the electronic device 200.

As an example, as shown in FIG. 2, in the unfolded state of theelectronic device 200, the hinge cover 265 may be hidden, and thus notexposed, by the first housing structure 210 and the second housingstructure 220. As another example, as shown in FIG. 3, in the foldedstate (e.g., the completely folded state) of the electronic device 200,the hinge cover 265 may be exposed to the outside between the firsthousing structure 210 and the second housing structure 220. As anotherexample, in an intermediate state of the electronic device 200, in whichthe first housing structure 210 and the second housing structure 220 arefolded with a certain angle, a portion of the hinge cover 265 may beexposed to the outside of the electronic device 200 between the firsthousing structure 210 and the second housing structure 220. In thiscase, the exposed area may be smaller than when the electronic device200 is in the folded state. According to an embodiment, the hinge cover265 may include a curved surface.

Described below are the operation of the first housing structure 210 andthe second housing structure 220 and each area of the display 230depending on the operation state (e.g., the unfolds state and foldedstate) of the electronic device 200.

According to an embodiment, when the electronic device 200 is in theunfolded state (e.g., the state as shown in FIG. 2), the first housingstructure 210 and the second housing structure 220 are 180-degree angledtherebetween, and the first area 231 a and second area 231 b of thedisplay may be placed to face in the same direction, e.g., displayscreen in the same direction, e.g., in directions parallel with eachother. The folding area 231 c may be flush with the first area 231 a andthe second area 231 b.

According to an embodiment, when the electronic device 200 is in thefolded state (e.g., the state as shown in FIG. 3), the first housingstructure 210 and the second housing structure 220 may face each other.For example, in the folded state (e.g., the state as shown in FIG. 3) ofthe electronic device 200, the first area 231 a and the second area 231b of the display 230 may be rendered to face each other, angled at asmall angle (e.g., from 0 degrees to 10 degrees) therebetween. In thefolded state (e.g., the state as shown in FIG. 3) of the electronicdevice 200, the folding area 231 c may at least partially form a curvedsurface with a predetermined curvature.

According to an embodiment, when the electronic device 200 is in anintermediate state, the first housing structure 210 and the secondhousing structure 220 may be angled therebetween at a certain angle. Forexample, in the intermediate state, the first area 231 a and second area231 b of the display 230 may be angled therebetween at an angle largerthan the angle when it is in the folded state and smaller than the anglewhen it is in the unfolded state. The folding area 231 c may at leastpartially have a curved surface with a predetermined curvature and, inthis case, the curvature may be smaller than that when it is in thefolded state.

FIG. 4 is an exploded perspective view illustrating an electronic device200 according to an embodiment of the disclosure.

Referring to FIG. 4, an electronic device 200 may include a display 230,a supporting member assembly 260, at least one printed circuit board270, a first housing structure 210, a second housing structure 220, afirst back cover 240, and a second back cover 250. In the disclosure,the display 230 may be interchangeably used with a display module ordisplay assembly.

The display 230 may include a display panel 231 (e.g., a flexibledisplay panel) and one or more plates 232 or layers seated on thedisplay panel 231. According to an embodiment, the plate 232 may bedisposed between the display panel 231 and the supporting memberassembly 260. The display panel 231 may be disposed on at least aportion of a surface (e.g., the Z-axis facing surface of FIG. 4) of theplate 232. The plate 232 may have a shape corresponding to the displaypanel 231. For example, a portion of the plate 232 may have a shapecorresponding to the shape of the notch area 233 of the display panel231.

The supporting member assembly 260 may include a first supporting member261, a second supporting member 262, a hinge structure 264 disposed withthe first supporting member 261 and the second supporting member 262, ahinge cover 265 covering the hinge structure 264 when the hingestructure 264 is viewed from the outside, and a wiring member (e.g., aflexible printed circuit board (FPCB)) crossing the first supportingmember 261 and the second supporting member 262.

According to an embodiment, the supporting member assembly 260 may bedisposed with the plate 232 and at least one printed circuit board 270.As an example, the first supporting member 261 may be disposed with thefirst area 231 a of the display 230 and a first printed circuit board271. The second supporting member 262 may be disposed with the secondarea 131 b of the display 230 and a second printed circuit board 272.

According to an embodiment, the wiring member 263 and the hingestructure 264 may be at least partially disposed inside the supportingmember assembly 260. The wiring member 263 may be disposed in adirection (e.g., the X-axis direction) crossing the first supportingmember 261 and the second supporting member 262. The wiring member 263may be disposed in a direction (e.g., the X-axis direction)perpendicular to the folding axis (e.g., the folding axis A of FIG. 1 orthe Y axis).

As mentioned above, the at least one printed circuit board 270 mayinclude the first printed circuit board 271 disposed on the firstsupporting member 261 and the second printed circuit board 272 disposedon the second supporting member 262. The first printed circuit board 271and the second printed circuit board 272 may be disposed inside a spaceformed by the supporting member assembly 260, the first housingstructure 210, the second housing structure 220, the first back cover240, and the second back cover 250. Components, e.g., at least one ofthe components of FIG. 1, for implementing various functions of theelectronic device 200 may be mounted on the first printed circuit board271 and the second printed circuit board 272.

According to an embodiment, the first housing structure 210 and thesecond housing structure 220 may be assembled together to be coupled toboth sides of the supporting member assembly 260, with the display 230coupled to the supporting member assembly 260. The first housingstructure 210 and the second housing structure 220 may be slidablycoupled to two opposite sides of the supporting member assembly 260,e.g., the first supporting member 261 and the second supporting member262, respectively.

According to an embodiment, the first housing structure 210 may includea first rotation supporting surface 214 (e.g., the fourth side surfaceportion 514 of FIG. 5, described below), and the second housingstructure 520 may include a second rotation supporting surface 224(e.g., the eighth side surface 523 of FIG. 5, described below)corresponding to the first rotation supporting surface 214. The firstrotation supporting surface 214 and the second rotation supportingsurface 224 may include a curved surface corresponding to a curvedsurface included in the hinge cover 265.

According to an embodiment, when the electronic device 200 is in theunfolded state (e.g., the state as shown in FIG. 2), the first rotationsupporting surface 214 and the second rotation supporting surface 224may cover the hinge cover 265, allowing the hinge cover 265 to be not orminimally exposed to the back surface of the electronic device 200.According to an embodiment, when the electronic device 200 is the foldedstate (e.g., the state as shown in FIG. 3), the first rotationsupporting surface 214 and the second rotation supporting surface 224may rotate along the curved surface of the hinge cover 265, maximallyexposing the hinge cover 265 to the back surface of the electronicdevice 200.

In the above description, the ordinal numbers as in the first housingstructure 210, second housing structure 220, first side surface member213 and the second side surface member 223 have been used merely fordistinguishing the components, and it should be noted that the scope ofthe disclosure is not limited by the use of ordinal numbers. Forexample, although the sensor area 231 d is formed in the first housingstructure 210 in the above example, the sensor area 231 d may be formedin the second housing structure 220 or in each of the first housingstructure 210 and the second housing structure 220. According to anembodiment, although the first back surface area 241 and the sub display252 are disposed in the first back cover 240 and the second back cover250, respectively, the first back surface area 241 for placing, e.g., asensor, and the sub display 252 for outputting screen, both, may bedisposed in either the first back cover 240 or the second back cover250.

According to an embodiment, in the plurality of housing structures 210and 220 and the hinge structure 264 supporting one display 230, anantenna device may be disposed in the first housing structure or thesecond housing structure. The antenna device is described below inconnection with an example configuration in which the antenna device isdisposed in the second housing structure. However, as mentioned above,embodiments of the disclosure are not limited thereto and it should benoted that the antenna device may be disposed in the first housingstructure of the electronic device, according to an embodiment.

FIG. 5 is a view illustrating a configuration of side surface member(s)501 and 502 in an electronic device (e.g., the electronic device 200 ofFIG. 2) according to an embodiment of the disclosure.

Referring to FIG. 5, the side surface members (e.g., the first sidesurface member 213 and second side surface member 223 of FIG. 4) mayinclude a first side surface member 501 provided as part of the firsthousing structure 210 of FIG. 2 and a second side surface member 502provided as part of the second housing structure 220. According to anembodiment, the first side surface member 501 and the second sidesurface member 502 may be shaped as a frame surrounding the internalspace of the housing structures (e.g., the first housing structure 210and second housing structure 220 of FIG. 2). According to an embodiment,the first side surface member 501 and the second side surface member 502may have substantially the same structure except for a slight differencein shape. According to an embodiment, the first side surface member 501and the second side surface member 502 may at least partially include anelectrically conductive material. For example, FIG. 5 substantiallyillustrates the electrically conductive material portions of the firstside surface member 501 and the second side surface member 502. Thefirst side surface member 501 and the second side surface member 502 mayinclude a non-conductive material, e.g., an insulating material,allowing their final shape to be a closed curve or loop.

According to an embodiment, the first side surface member 501 mayinclude a first side surface portion 511, a second side surface portion512, a third side surface portion 513, a fourth side surface portion514, and/or a fifth side surface portion 515. According to anembodiment, the first to fifth side surface portions 511, 512, 513, 514,and 515 may also be referred to as a ‘first to fifth side surfaceportion partial frame.’ According to an embodiment, the first sidesurface portion 511 may be disposed in parallel with the folding axis A.The second side surface portion 512 may be disposed spaced apart from anend (e.g., the top) of the first side surface portion 511 in a directioncrossing the folding area A or substantially perpendicular to thefolding area A. The third side surface portion 513 may be disposedspaced apart from the opposite end (e.g., the bottom) of the first sidesurface portion 511 in parallel with the folding area A.

The fourth side surface portion 514 may be disposed adjacent to an endof the third side surface portion 513 and may be disposed spaced apartfrom the third side surface portion 513 and may extend to the foldingarea A in a direction crossing, or in a direction substantiallyperpendicular. The fifth side surface portion 515 may extendsubstantially in parallel with the folding area A or the first sidesurface portion 511. One end of the fifth side surface portion 515 isdisposed spaced apart from an end of the second side surface portion512, and the other end of the fifth side surface portion 515 is disposedspaced apart from an end of the fourth side surface portion 514.According to an embodiment, the fifth side surface portion 515 may bedisposed adjacent to the hinge structure or hinge cover (e.g., the hingestructure 264 or hinge cover 265 of FIG. 4) and may extend along thefolding area A substantially in parallel with the hinge structure 264 orhinge cover 265.

According to an embodiment, the first side surface member 501 mayinclude a slit(s) 516 a, 516 b, 516 c, 516 d, and 516 e at leastpartially separating the electrically conductive material portions.According to an embodiment, the slit(s) 516 a, 516 b, 516 c, 516 d, and516 e may be filled with a non-conductive material which may be referredto as a ‘non-conductive portion’ or ‘non-conductive material portion’ asnecessary. A structure formed of an insulating material may be formed inat least part of the area surrounded by the first to fifth side surfaceportions 511, 512, 513, 514, and 515. According to an embodiment, theslit(s) 516 a, 516 b, 516 c, 516 d, and 516 e may be filled with aninsulating material. For example, the first side surface member 501 mayinclude a non-conductive portion, a non-conductive material portion, oran insulating material portion that insulates some electricallyconductive material portion from the other electrically conductivematerial portions.

According to an embodiment, the first slit 516 a may be formed betweenone end of the first side surface portion 511 and the second sidesurface portion 512, and the second slit 516 b may be formed between thesecond side surface portion 512 and the fifth side surface portion 515.The third slit 516 c may be formed between the opposite end of the firstside surface portion 511 and the third side surface portion 513. Thefourth slit 516 d may be formed between the third side surface portion513 and the fourth side surface portion 514, and the fifth slit 516 emay be formed between the fourth side surface portion 514 and the fifthside surface portion 515.

At least part of the second side surface portion 512, the third sidesurface portion 513, and the fourth side surface portion 514 may beformed of an electrically conductive material. For example, at leastpart of the second side surface portion 512, the third side surfaceportion 513, and/or the fourth side surface portion 514 may be formed ofa radiation conductor. According to an embodiment, the second sidesurface portion 512, the third side surface portion 513, and/or thefourth side surface portion 514 may function as an antenna radiator(e.g., a radiation conductor) of the electronic device (e.g., theelectronic device 200 of FIG. 2). For example, the processor (e.g., theprocessor 120 of FIG. 1) or communication module (e.g., thecommunication module 190) of the electronic device 200 may performwireless communication using a portion of the second side surfaceportion 512, the third side surface portion 513, and/or the fourth sidesurface portion 514.

According to an embodiment, a portion of the first side surface portion511 (or the fifth side surface portion 515) may be electricallyconnected to the printed circuit board (e.g., the first printed circuitboard 271 of FIG. 4) to be utilized as a radiation conductor. Forexample, a power supply portion formed in the first side surface portion511 may be electrically connected to the printed circuit board (e.g.,the first printed circuit board 271 of FIG. 4), and a ground portionformed in other position of the first side surface portion 511 may beconnected to the printed circuit board (e.g., the first printed circuitboard 271 of FIG. 4). The electrically conductive material portion ofthe first side surface portion 511 may form part of the antenna betweenthe position where the power supply portion is connected and where theground portion is connected.

According to an embodiment, the third side surface portion 513 mayinclude a first portion 513 a and a second portion 513 b. For example,the first portion 513 a may be formed in a first length L1 along adirection parallel with a first axis (e.g., the folding area A of FIG.5). The second portion 513 b may be connected to the first portion 513 aand be formed to be curved. The second portion 513 b may be formed in asecond length L2 along a direction crossing the first axis (e.g., thefolding area A of FIG. 5).

According to an embodiment, the third slit 516 c may be formed betweenthe first side surface portion 511 and the third side surface portion513. According to an embodiment, as the third slit 516 c is formed in aposition of the first length L1 which is a distance D1 not less than 30mm and not more than 50 mm (e.g., 40 mm) from the second portion 513 bof the third side surface portion 513, it may be operated as a radiationconductor (e.g., the third side surface portion 513) with a radiationperformance required by the electronic device (e.g., the electronicdevice 200 of FIG. 2).

According to an embodiment, the radiation feature depending on theposition of the third slit 516 c is described below in greater detailwith reference to FIG. 13 or 14. The above values regarding the positionof the third slit 516 c are example values applicable to the electronicdevice in which the width (e.g., the length along the X-axis directionof FIG. 4) of the second side surface member 502 is 100 mm or less, butit should be noted that embodiments of the disclosure are not limitedthereto. For example, the third slit 516 c may be formed in a differentposition than that of the example values considering the resonancefrequency to be formed using the radiation conductor or the size of theelectronic device to be actually manufactured. For example, the thirdslit 516 c may be formed in the position of the first length L1 which isthe distance D1 not less than 30 mm and not more than 50 mm (e.g., 40mm) from the outer side of the second portion 513 b of the third sidesurface portion 513, thus reducing the radiation performancedeterioration of the radiation conductor (e.g., the third side surfaceportion 513) and the radiation performance deterioration of theradiation conductor (e.g., the third side surface portion 513) due toinfluence by the user's body when the user makes a call with theelectronic device (e.g., the electronic device 200 of FIG. 2) in hishand. As such, the third slit 516 c may enhance the radiationperformance of the radiation conductor (e.g., the third side surfaceportion 513).

According to an embodiment, as described above in connection with FIG.5, the first length L1 of the third side surface portion 513 may be alength (e.g., 40 mm) between 30 mm and 50 mm along the directionparallel with the first axis (e.g., the folding area A of FIG. 5), andthe second length L2 of the third side surface portion 513 may be alength (e.g., 18.6 mm) between 8.6 mm and 28.6 mm along the directioncrossing the first axis (e.g., the folding area A of FIG. 5).

According to an embodiment, allowing the first length L1 to be largerthan the second length L2 may minimize the radiation performancedeterioration of the radiation conductor (e.g., the third side surfaceportion 513) and hence enhance the radiation performance of theradiation conductor (e.g., the third side surface portion 513).

According to an embodiment, the first length L1 may be formed to beidentical to be the second length L2. When the electronic device 200 isfolded, the eighth side surface portion 523 may be positioned adjacentto the third side surface portion 513. The eighth side surface portion523 may include a third portion 523 a and a fourth portion 523 b. Whenviewed from above the first back cover (e.g., the first back cover 240of FIG. 2), the third slit 516 c may be formed to overlap the eighthslit 526 c, and the fourth slit 516 d may be formed to overlap the ninthslit 526 d. Thus, in the plurality of housing structures 210 and 220 andthe hinge structure (e.g., the hinge structure 264 of FIG. 4) supportingone display (e.g., the display 230 of FIG. 4), when the electronicdevice 200 is folded, an end of the third side surface portion 513 andan end of the eighth side surface portion 523 may be rendered to meet,thereby reducing the radiation performance deterioration of theradiation conductor (e.g., the third side surface portion 513 and theeighth side surface portion 523).

As mentioned above, the ordinal numbers have been used herein simply todistinguish between the components, and embodiments of the disclosureare not limited thereto. For example, the first side surface member 501may be referred to as a ‘second side surface member,’ and the fifth sidesurface portion 515 may be referred to as the ‘first side surfaceportion 511’ in other embodiments. For example, although some componentsare distinguished therebetween by use of ordinal numbers, this is merelyfor simplicity purposes, and various embodiments of the disclosureshould be appreciated by the arrangement and connections of the relevantcomponents.

An example configuration of an antenna device (e.g., 500 of FIG. 6)using the above-described structure of side surface member(s) isdescribed below in greater detail with reference to FIGS. 6 and 7. Theconfiguration shown in FIGS. 6 and 7 may regard an example in which oneelectrically conductive material portion as insulated by theabove-described slits from the other electrically conductive materialportions is configured as a radiation conductor. In another embodiment,as described above, a portion of another electrically conductivematerial portion, e.g., the first side surface portion 511 or the sixthside surface portion 521, which is not shown in FIGS. 6 and 7 may beused to form an antenna device. Or, the third side surface portion 513or the eighth side surface portion 523 may also be partially used as aradiation conductor. In the following embodiments, the componentsidentical to those in the above embodiments or easy to understand fromthe description of the above embodiments are denoted with or without thesame reference numerals and their detailed description may be skipped.

FIGS. 6 and 7 are views illustrating a configuration of an antennadevice 500 in an electronic device (e.g., the electronic device 200 ofFIG. 1) according to various embodiments of the disclosure.

FIGS. 6 and 7 are enlarged views of portion B of FIG. 5.

Referring to FIGS. 6 and 7, the antenna device 500 may include a firstelectrically conductive material portion (e.g., a portion of the firstside surface portion 511), which is a portion of the first side surfaceportion 511, a first electrically conductive material portion (e.g., thesecond side surface portion 512), which is a portion of the second sidesurface portion 512, a first electrically conductive material portion(e.g., a portion of the third side surface portion 513), which is aportion of the third side surface portion 513, a first electricallyconductive material portion (e.g., the fourth side surface portion 514),which is a portion of the fourth side surface portion 514, and a firstelectrically conductive material portion (e.g., the fifth side surfaceportion 515), which is a portion of the fifth side surface portion 515.

According to an embodiment, at least a portion of the first electricallyconductive material portion forming the first side surface portion 511may be provided as the radiation conductor, at least a portion of thefirst electrically conductive material portion forming the second sidesurface portion 512 may be provided as the radiation conductor, at leasta portion of the first electrically conductive material portion formingthe third side surface portion 513 may be provided as the radiationconductor, at least a portion of the first electrically conductivematerial portion forming the fourth side surface portion 514 may beprovided as the radiation conductor, and at least a portion of the firstelectrically conductive material portion forming the fifth side surfaceportion 515 may be provided as the radiation conductor. For example, thefourth slit 516 d may be formed between the third side surface portion513 and the fourth side surface portion 514, and the fourth slit 516 dmay separate the third side surface portion 513 and the fourth sidesurface portion 514 from each other.

According to an embodiment, the third slit 516 c, the fourth slit 516 d,and/or the fifth slit 516 e may be filled with an insulating material.For example, the third slit 516 c, the fourth slit 516 d, and/or thefifth slit 516 e may form a first non-conductive portion, thusinsulating the two adjacent electrically conductive portions whilemechanically connecting or coupling them.

According to an embodiment, the first conductive portion may be thewhole or part of the third side surface portion 513. The third sidesurface portion 513 may include a first portion 513 a and a secondportion 513 b. For example, the first portion 513 a may be formed in afirst length L1 along a direction parallel with a first axis (e.g., thefolding area A of FIG. 5). The second portion 513 b may be connected tothe first portion 513 a and be partially formed to be curved. The secondportion 513 b may be formed in a second length L2 along a directioncrossing the first axis (e.g., the folding area A of FIG. 5). The firstconductive portion may be the whole or part of the fourth side surfaceportion 514 and may extend perpendicular to the first axis (e.g., thefolding area A of FIG. 5). According to an embodiment, the first lengthL1 may be substantially the same as the third length L3, and the secondlength L2 may be substantially the same as the fourth length L4.

According to an embodiment, the third slit 516 c may be formed in aposition symmetrical to the eighth slit 526 c. For example, when viewedfrom above the first back cover (e.g., the first back cover 240 of FIG.2) in the folded state of the electronic device, at least a portion ofthe third slit 516 c may overlap the eighth slit 526 c.

According to an embodiment, the radiation feature depending on theposition of the third slit 516 c is described below in greater detailwith reference to FIG. 13 or 14. The above values regarding the positionof the third slit 516 c are example values applicable to the electronicdevice (e.g., the electronic device 200 of FIG. 2) in which the width(e.g., the length along the X-axis direction of FIG. 4) of the firstside surface member 501 is 200 mm or less, but it should be noted thatembodiments of the disclosure are not limited thereto. For example, thethird slit 516 c may be formed in a different position than that of theexample values considering the resonance frequency to be formed usingthe radiation conductor or the size of the electronic device (e.g., theelectronic device 200 of FIG. 2) to be actually manufactured.

According to an embodiment, as described above in connection with FIGS.6 and 7, the first length L1 of the third side surface portion 513 maybe 40 mm along the direction parallel with the first axis (e.g., thefolding area A of FIG. 5), and the second length L2 of the third sidesurface portion 513 may be 18.6 mm along the direction crossing thefirst axis (e.g., the folding area A of FIG. 5). For example, a lengthof the third side surface portion 513 formed based on the first lengthL1 and the second length L2 may correspond to an electrical length of aselected resonance frequency (e.g., a low-band resonance frequency).

Referring to FIGS. 6 and 7, the third side surface portion 513 may beelectrically connected with the printed circuit board 530. For example,the third side surface portion 513 may include a ground terminal 513 c,a power supply terminal 513 d, and/or a switch terminal 513 e.

The ground terminal 513 c may be electrically connected with a groundportion G provided on the printed circuit board 530, and the groundterminal 513 c may be provided in the third side surface portion 513 tobe connected to the wireless communication circuit (e.g., the processor120 or communication module 190 of FIG. 1) in the position adjacent tothe fourth slit 516 d.

The ground terminal 513 c may include a ground member, and the groundterminal 513 c may be electrically connected with the antenna ground.For example, the ground member may include at least one of a leafspring, a C-clip, a screw, or a flexible printed circuit board 530(FPCB). The antenna ground may be a conductive layer adjacent to theantenna and may be a conductive layer electrically connected with theground terminal 513 c. For example, the antenna ground may include atleast one of a PCB ground, a conductive bracket, and a display ground.

The power supply terminal 513 d as shown in FIG. 7 may be electricallyconnected to a power supply portion F provided on the printed circuitboard 530. For example, the power supply terminal 513 d may be providedin the third side surface portion 513 to be able to receive power viathe power supply portion F of the printed circuit board 530 electricallyconnected between the ground terminal 513 c and the switch terminal 513e.

According to an embodiment, the electronic device (e.g., the electronicdevice 200 of FIG. 1) may include a switch portion S disposed in a spaceformed by the foldable housings (e.g., the pair of housing structures210 and 220 of FIG. 2). For example, in the plurality of housingstructures 210 and 220 and hinge structure (e.g., the hinge structure264 of FIG. 4) supporting one display (e.g., the display 230 of FIG. 4),the switch portion S may be electrically connected with the switchterminal 513 e provided in the third side surface portion 513 and mayselectively connect the antenna ground with the third side surfaceportion 513 via one of a plurality of matching paths M1, M2, . . . , Mx.The antenna ground may include the above-described ground portion. Here,“the switch portion selectively connects one of the plurality ofmatching paths to the third side surface portion 513” may mean that theswitch portion S does not connect the third side surface portion 513with the antenna ground (e.g., the ground portion G) or the switchportion S may connect the third side surface portion 513 with theantenna ground through a matching path M1, M2, . . . , Mx selected underthe control of the processor (e.g., the processor 120 of FIG. 1).According to an embodiment, the switch portion S may selectively combinetwo or more matching paths under the control of the processor, therebyconnecting the third side surface portion 513 with the antenna ground.According to an embodiment, by connecting the third side surface portion513 with the antenna ground via the selected matching path using theswitch portion S, the radiation feature of the antenna device 500 may bestabilized or the resonance frequency may be adjusted. According to anembodiment, the antenna ground (e.g., the ground portion G) may includea ground area of the circuit board provided in the electronic device(e.g., the electronic device 200 of FIG. 2), a ground provided in thedisplay (e.g., the display 230 of FIG. 4), or a metal structureelectrically connected with the ground. According to an embodiment, thematching paths M1, M2, . . . , Mx may stay connected to a common ground(e.g., the ground portion G).

According to an embodiment, the wireless communication circuit may beelectrically connected with the power supply terminal 513 d provided inthe third side surface portion 513, performing wireless communicationusing the third side surface portion 513. According to an embodiment,the third side surface portion 513 may form various frequency bands ofresonance frequencies depending on its electrical lengths, and thewireless communication circuit may be configured to transmit or receivesignals in a frequency band ranging from about 500 MHz to about 6 GHz,using the third side surface portion 513. According to an embodiment,the electronic device 200 may include a plurality of wirelesscommunication circuits, and the wireless communication circuits maytransmit or receive different frequency bands of signals using the thirdside surface portion 513.

According to an embodiment, the power supply terminal 514 a provided inthe fourth side surface portion 514 may be electrically connected withthe power supply portion F of the printed circuit board (e.g., theprinted circuit board 530 of FIG. 7), and a portion of the electricallyconductive material portion of the fourth side surface portion 514 maybe used as an additional radiation conductor forming another resonancefrequency. For example, the electronic device 200 may perform wirelesscommunication using a portion of the fourth side surface portion 514.According to an embodiment, the fourth side surface portion 514 may beelectrically connected with the ground portion in a different position.

According to an embodiment, the second side surface member 502 mayinclude a sixth side surface portion 521, a seventh side surface portion522, an eighth side surface portion 523, a ninth side surface portion524, and/or the tenth side surface portion 525. According to anembodiment, the sixth to tenth side surface portions 521, 522, 523, 524,and 525 may also be referred to as a ‘sixth to tenth side surfaceportion (525) frame.’ According to an embodiment, at least a portion ofthe sixth side surface portion 521 may be disposed in parallel with thefolding area A. The seventh side surface portion 522 may be disposedspaced apart from an end (e.g., the top) of the sixth side surfaceportion 521 in a direction crossing the folding area A or substantiallyperpendicular to the folding area A. The eighth side surface portion 523may be disposed spaced apart from the opposite end (e.g., the bottom) ofthe sixth side surface portion 521 in parallel with the folding area A.

The ninth side surface portion 524 may be disposed adjacent to an end ofthe eighth side surface portion 523 and may be disposed spaced apartfrom the eighth side surface portion 523 and may extend to the foldingarea A in a direction crossing, or in a direction substantiallyperpendicular. The tenth side surface portion 525 may extendsubstantially in parallel with the folding area A. One end of the tenthside surface portion 525 is disposed spaced apart from the an end of theseventh side surface portion 522, and the other end of the tenth sidesurface portion 525 is disposed spaced apart from an end of the ninthside surface portion 524. According to an embodiment, the tenth sidesurface portion 525 may be disposed adjacent to the hinge structure orhinge cover (e.g., the hinge structure 264 or hinge cover 265 of FIG. 4)and may extend along the folding area A substantially in parallel withthe hinge structure or hinge cover.

According to an embodiment, the second side surface member 502 mayinclude other slit(s) 526 a, 526 b, 526 c, 526 d, and 526 e at leastpartially separating the electrically conductive material portions. Astructure formed of an insulating material may be formed in at leastpart of the area surrounded by the fifth to tenth side surface portions521, 522, 523, 524, and 525. According to an embodiment, the slit(s) 526a, 526 b, 526 c, 526 d, and 526 e may be filled with an insulatingmaterial. For example, the second side surface member 502 may include aninsulating material portion that insulates some electrically conductivematerial portion from the other electrically conductive materialportions.

According to an embodiment, the sixth slit 526 a may be formed betweenone end of the sixth side surface portion 521 and the seventh sidesurface portion 522, and the seventh slit 526 b may be formed betweenthe seventh side surface portion 522 and the tenth side surface portion525. The eighth slit 526 c may be formed between the opposite end of thesixth side surface portion 521 and the eighth side surface portion 523.The ninth slit 526 d may be formed between the eighth side surfaceportion 523 and the ninth side surface portion 524, and the tenth slit526 e may be formed between the ninth side surface portion 524 and thetenth side surface portion 525.

At least part of the seventh side surface portion 522, the eighth sidesurface portion 523, and the ninth side surface portion 524 may beformed of an electrically conductive material. At least part of theseventh side surface portion 522, the eighth side surface portion 523,and/or the ninth side surface portion 524 may be formed as a radiationconductor. According to an embodiment, the seventh side surface portion522, the eighth side surface portion 523, and/or the ninth side surfaceportion 524 may function as an antenna radiator (e.g., a radiationconductor) of the electronic device (e.g., the electronic device 200 ofFIG. 2). For example, the processor (e.g., the processor 120 of FIG. 1)or communication module (e.g., the communication module 190) of theelectronic device 200 may perform wireless communication using a portionof the seventh side surface portion 522, the eighth side surface portion523, and the ninth side surface portion 524.

For example, when viewed from above the first back cover (e.g., thefirst back cover 240 of FIG. 2) in the folded state of the electronicdevice (e.g., the electronic device 200 of FIG. 2), at least a portionof the eighth slit 526 c may overlap the third slit 516 c.

According to an embodiment, the third length L3 may be substantially thesame as the first length L1, and the fourth length L4 may besubstantially the same as the second length L2. The third length L3 andthe fourth length L4 may be identical or similar in value to the firstlength L1 and the second length L2 of FIG. 5, and no duplicatedescription thereof is given below.

FIG. 8 is a perspective view illustrating an electronic device (e.g.,the electronic device 200 of FIG. 2) in a folded state according to anembodiment of the disclosure.

FIG. 9 is a plan view illustrating an electronic device (e.g., theelectronic device 200 of FIG. 2) in a folded state according to anembodiment of the disclosure.

FIG. 10 is a side view illustrating a third slit 516 c and an eighthslit 526 c among components of an electronic device (e.g., theelectronic device 200 of FIG. 2) in a folded state according to anembodiment of the disclosure.

FIG. 11 is s bottom view illustrating a fourth, fifth, ninth, and tenthslit 516 d, 516 e, 526 d, and 526 e among components of an electronicdevice (e.g., the electronic device 200 of FIG. 2) in a folded stateaccording to an embodiment of the disclosure.

Referring to FIGS. 8 through 11, an electronic device (e.g., theelectronic device 200 of FIG. 2) may include a first housing structure(e.g., the first housing structure 210 of FIG. 2), a second housingstructure, (e.g., the second housing structure 220 of FIG. 2), and ahinge structure (e.g., the hinge structure 264 of FIG. 4). As the firsthousing structure (e.g., the first housing structure 210 of FIG. 2) andthe second housing structure (e.g., the second housing structure 220 ofFIG. 2) each rotate on the hinge structure (e.g., the hinge structure264 of FIG. 4), they may be folded so that the first surface 211 of thefirst housing structure 210 faces the third surface 221 of the secondhousing structure 220.

According to an embodiment, as the first and second side surface members501 and 502 are viewed from the outside, as shown in FIG. 10, in theposition where the first housing structure is folded to face the secondhousing structure, the third slit 516 c and the eighth slit 526 c may bealigned to be adjacent to each other. According to an embodiment, thethird slit 516 c may be formed in the first side surface member 501, andthe eighth slit 526 c may be formed in the second side surface member502. In this state, when the first side surface member 501 or the secondside surface member 502 is viewed from the outside in the position wherethe first housing structure is folded to face the second housingstructure, the third slit 516 c formed in the first side surface member501 and the eighth slit 526 c formed in the second side surface member502 may be aligned to be adjacent to each other.

According to an embodiment, when the bottom of the first and second sidesurface members 501 and 502 is viewed from the outside in the foldedstate of the electronic device (e.g., the electronic device 200 of FIG.2), the fourth slit 516 d and the fifth slit 516 e formed in the firstside surface member 501 and the ninth slit 526 d and the tenth slit 526e formed in the second side surface member 502 may be aligned to beadjacent to each other. For example, in the folded state of theelectronic device (e.g., the electronic device 200 of FIG. 2), thenon-conductive portions formed in the fourth slit 516 d and fifth slit516 e and the ninth slit 526 d and tenth slit 526 e may also be alignedto be adjacent to each other.

Referring to FIGS. 2 and 5, as the first housing structure (e.g., thefirst housing structure 210 of FIG. 2) and the second housing structure(e.g., the second housing structure 220 of FIG. 2) each rotate on thehinge structure (e.g., the hinge structure 264 of FIG. 4), they may befolded so that the first surface 211 of the first housing structure 210and the third surface 221 of the second housing structure 220 may bearranged side-by-side. For example, in the state where the first surface211 faces the third surface 221, the first housing structure 210 and thesecond housing structure 220 may be rotated on the hinge structure(e.g., the hinge structure 264 of FIG. 4), unfolding and positioningthemselves side-by-side. In this case, the first, second, third, fourth,and fifth slits 516 a, 516 b, 516 c, 516 d, and 516 e of the first sidesurface member 501 of the first housing structure 210 and the sixth,seventh, eighth, ninth, and tenth slits 526 a, 526 b, 526 c, 526 d, and526 e of the second supporting member 262 of the second housingstructure 220 may be arranged symmetrical with each other with respectto the hinge structure (e.g., the hinge structure 264 of FIG. 4).

FIG. 12 is a view illustrating a configuration of an antenna device 600in an electronic device (e.g., the electronic device 200 of FIG. 1)according to an embodiment of the disclosure.

Referring to FIG. 12, the first conductive portion of the antenna device600 may be the whole or part of the third side surface portion 613 ofthe first side surface member. The third side surface portion 613 mayinclude a first portion 613 a and a second portion 613 b. For example,the first portion 613 a may be formed in a first length L1 along adirection parallel with a first axis (e.g., the folding area A of FIG.5). The second portion 613 b may be connected to the first portion 613 aand be formed to be curved. The second portion 513 b may be formed in asecond length L2 along a direction crossing the first axis (e.g., thefolding area A of FIG. 5). The first conductive portion may be the wholeor part of the fourth side surface portion 614 and may extendperpendicular to the first axis (e.g., the folding area A of FIG. 5).

According to an embodiment, the third slit 616 c may be formed betweenthe first side surface portion 611 and the third side surface portion613 in a position a predetermined distance away from the first portion613 a of the third side surface portion 613 in a direction parallel withthe first axis (e.g., the folding area A of FIG. 5). According to anembodiment, as the third slit 616 c is formed in the position of a firstlength L1 which is a distance D1 not less than 30 mm and not more than50 mm (e.g., 46 mm) from the first portion 613 a of the third sidesurface portion, a radiation conductor (e.g., the third side surfaceportion 613) with a radiation performance required in the plurality ofhousing structures 210 and 220 and hinge structure (e.g., the hingestructure 264 of FIG. 4) supporting one display (e.g., the display 230of FIG. 4) may be provided, the radiation performance deterioration ofthe radiation conductor (e.g., the third side surface portion 613) maybe reduced, and the radiation performance deterioration of the radiationconductor (e.g., the third side surface portion 613) due to influence bythe user's body in the user's hand grip on the electronic device (e.g.,the electronic device 101 of FIG. 1) may be reduced. As such, the thirdslit 616 c may enhance the radiation performance of the radiationconductor (e.g., the third side surface portion). For example, when ahuman body approaches an end of the radiation conductor (e.g., the thirdside surface portion 613), a drastic variation in the resonancefrequency may occur, resulting in radiation performance deterioration.Thus, repositioning the third slit 616 c by the first length L1 mayenhance the radiation performance of the radiation conductor (e.g., thethird side surface portion).

According to an embodiment, as described above in connection with FIG.12, the first length L1 of the third side surface portion 613 may be alength (e.g., 46 mm) between 0 mm and 50 mm along the direction parallelwith the first axis (e.g., the folding area A of FIG. 5), and the secondlength L2 of the third side surface portion 613 may be a length (e.g.,12.6 mm) between 2.6 mm and 22.6 mm along the direction crossing thefirst axis (e.g., the folding area A of FIG. 5).

For example, the sum of the first length L1 and the second length L2 maycorrespond to an electrical length of a low-band resonance frequency,and allowing the first length L1 to be larger than the second length L2may turn the flow of ground current shown in FIG. 13, described below,from the horizontal direction to the vertical direction. This mayminimize the radiation performance deterioration of the radiationconductor (e.g., the third side surface portion 513) and hence enhancethe radiation performance of the radiation conductor (e.g., the thirdside surface portion 513).

Referring to FIG. 12, the third side surface portion 613 may beelectrically connected with the printed circuit board (e.g., the printedcircuit board 530 of FIG. 7). For example, the third side surfaceportion 613 may include a ground terminal 613 c and a power supplyterminal 613 d.

The ground terminal 613 c may be electrically connected with a groundportion G provided on the printed circuit board, and the ground terminal613 c may be provided in the third side surface portion 613 to beconnected to the wireless communication circuit (e.g., the processor 120or communication module 190 of FIG. 1) in a position between the fourthslit 616 d and the power supply terminal 613 d.

The ground terminal 613 c may include a ground member, and the groundterminal 613 c may be electrically connected with the antenna ground.

The power supply terminal 613 d may be electrically connected with thepower supply portion F provided on the printed circuit board (e.g., theprinted circuit board 530 of FIG. 7). For example, the power supplyterminal 613 d may be provided in the third side surface portion 613 tobe able to receive power via the power supply portion F of the printedcircuit board (e.g., the printed circuit board 530 of FIG. 7)electrically connected in the position adjacent to the ground terminal613 c.

According to an embodiment, a power supply terminal 614 a provided inthe fourth side surface portion 614, independently from the third sidesurface portion 613, may be electrically connected with the power supplyportion F of the printed circuit board (e.g., the printed circuit board530 of FIG. 7), and a portion of the electrically conductive materialportion of the fourth side surface portion 614 may be used as anadditional radiation conductor forming another resonance frequency. Forexample, the power supply terminal 614 a may be provided in the fourthside surface portion 614 to be able to receive power via the powersupply portion F of the printed circuit board (e.g., the printed circuitboard 530 of FIG. 7) electrically connected in the position adjacent tothe fourth slit 616 d.

For example, variations in radiation feature and current flow dependingon the position of the slits (e.g., the third slit 516 c and the eighthslit 526 c of FIG. 5) when the electrically conductive material portionsof the first and second housing structures (e.g., the first and secondhousing structures 210 and 220 of FIG. 2) are used as a radiationconductor in the plurality of housings (e.g., the first and secondhousing structures 210 and 220 of FIG. 2) and hinge structure (e.g., thehinge structure 264 of FIG. 4) supporting one display (e.g., the display230 of FIG. 4) in the foldable electronic device (e.g., the electronicdevice 200 of FIG. 2) are described below with reference to FIGS. 13 to15.

FIG. 13 is a view illustrating a current flow formed in the first andsecond side surface members 501 and 502 of the first and second housingstructures (e.g., the first and second housing structures 210 and 220 ofFIG. 2) in the electronic device (e.g., the electronic device 200 ofFIG. 2) according to an embodiment of the disclosure.

FIG. 13 illustrates the current flow in the case where a radiationconductor is implemented by placing the third slit 516 c between thefirst side surface portion 511 and the third side surface portion 513and the eighth slit (e.g., the eighth slit 526 c of FIG. 5) between thesixth second surface portion (e.g., the sixth side surface portion 521of FIG. 5) and the eighth side surface portion (e.g., the eighth sidesurface portion 523 of FIG. 5), the power supply portion and the groundportion are connected in the same manner as shown in FIG. 6. It may beidentified that upon performing wireless communication using the thirdside surface portion 513 and the eighth side surface portion 523 as theradiation conductor, the current flow in the electronic device 200 mayturn from the shorter-axis direction (e.g., the X-axis direction) of theelectronic device to the longer-axis direction (e.g., the Y-axisdirection) of the electronic device.

It may thus be identified that as the current flow turns into thelonger-axis direction (e.g., the Y-axis direction) in the structure ofFIGS. 6 and 9, the electronic device 200 may be given a better antennaperformance.

FIG. 14 is a view illustrating the flow of radiation current through theground of the display (e.g., the display 230 of FIG. 4) as theconductive layer (e.g., a shielding sheet or display ground layer) ofthe display (e.g., the display 230 of FIG. 4) operates as the antennaground when the electronic device is in the folded state, according toan embodiment of the disclosure.

Referring to FIGS. 13 and 14, in the folded state of the electronicdevice (e.g., the electronic device 200 of FIG. 2), the conductive layerof the display (e.g., the display 230 of FIG. 4) is included as theantenna ground and a specific frequency band (e.g., 1 GHz) of radiationcurrent flows through the conductive layer of the display (e.g., thedisplay 230 of FIG. 4). The ground of the display (e.g., the display 230of FIG. 4) may have the largest electrical length among the antennagrounds and may thus have a largest influence on radiation. For example,in the case where the ground of the display (e.g., the display 230 ofFIG. 4) is formed long along the X axis, if the electronic device (e.g.,the electronic device 200 of FIG. 2) is folded, the X axis may be formedas the dominant radiation current direction of antenna. In the foldedelectronic device (e.g., the electronic device 200 of FIG. 2), theradiation current flows in the first and second side surface members 501and 502 may be disturbed due to their mutual interference, resulting inperformance deterioration. This may be addressed by forming the thirdslit 516 c and the eighth slit 526 c and the third side surface portion513 and eighth side surface portion 523 (e.g., a radiation conductor) inthe first and second side surface members 501 and 502. For example,allowing the first and third lengths L1 and L3 of the third and eighthside surface portions 513 and 523 to be larger than the second andfourth lengths L2 and L4 of the third and eighth side surface portions513 and 523 enables the current induced in the adjacent ground to beinduced along the Y axis, rather than the X axis, thereby minimizinginterference.

FIG. 15 is a graph illustrating a radiation pattern of an electronicdevice 200 in a low band (e.g., an 800 MHz band) in the folded stateaccording to an embodiment of the disclosure.

Referring to FIG. 15, ‘K1’ denotes the radiation pattern of antennaobtained by supplying power to a radiation conductor (e.g., the fourthside surface portion 514 of FIG. 5) provided at the bottom of theelectronic device, in the low band (e.g., an 800 MHz band), when theelectronic device has no side slit (e.g., the third slit 516 c and theeighth slit 526 c of FIG. 5) but has bottom slits (e.g., the fourth slit516 d, fifth slit 516 e, ninth slit 526 d, and tenth slit 526 e of FIG.5), and ‘K2’ denotes the radiation pattern of antenna obtained bysupplying power to the third and eighth side surface portions (e.g., thethird and eighth side surface portions 513 and 523 of FIG. 5) used as aradiation conductor, in the low band (e.g., an 800 MHz band), when theelectronic device has side slits (e.g., the third slit 516 c and eighthslit 526 c of FIG. 5) and the third and eighth side surface portions(e.g., the third side surface portion 513 and eighth side surfaceportion 523 of FIG. 5).

For example, in the plurality of housing structures 210 and 220 andhinge structure (e.g., the hinge structure 264 of FIG. 4) supporting onedisplay (e.g., the display 230 of FIG. 4), using the radiation conductorof the third and eighth side surface portions (e.g., the third sidesurface portion 513 and eighth side surface portion 523 of FIG. 5) as anantenna after forming the side slits may yield a radiation pattern ofmore directions as compared with the radiation conductor (e.g., thefourth side surface portion 514 of FIG. 5) provided at the bottom of theelectronic device.

As described above in connection with FIGS. 10 and 11, when the side ofthe first side surface member 501 and the second side surface member 502is viewed from the outside in the folded state of the electronic device(e.g., the electronic device 200 of FIG. 2), the third slit 516 c andthe eighth slit 526 c may be aligned to be adjacent to each other, andwhen the bottom of the first and second side surface members 501 and 502is viewed from the outside in the folded state of the electronic device(e.g., the electronic device 200 of FIG. 2), the fourth slit 516 d, thefifth slit 516 e, the ninth slit 526 d, and the tenth slit 526 e may bealigned to be adjacent to each other.

As shown in FIG. 15, it may be identified that ‘K2’ yields a more stableradiation pattern than ‘K1.’ For example, while the radiation pattern of‘K2’ is a stable radiation pattern, close to a circle, the radiationpattern of ‘K1’ is an irregular radiation pattern far from a circle.Thus, formation of the third slit (e.g., the third slit 516 c of FIG. 5)and the eighth slit (e.g., the eighth slit 526 c of FIG. 5) in the sideof the first and second side surface members 501 and 502 allows forstable antenna performance in the plurality of housing structures 210and 220 and hinge structure (e.g., the hinge structure 264 of FIG. 4)supporting one display (e.g., the display 230 of FIG. 4), when theelectronic device is in the folded state, thus enhancing the antennaperformance and hence reducing the radiation performance deteriorationof the radiation conductor due to influence by the user's body when theuser makes a call with the electronic device 200 in his hand.

FIG. 16A is a view illustrating a first, second, third, and fourthdistance G1, G2, G3, and G4 of slots (e.g., the third slit 516 c of FIG.5) formed in a first side surface (e.g., the first side surface 213 a ofFIG. 2) of an electronic device 200, or a first, second, third, andfourth distance H1, H2, H3, and H4 of slots (e.g., the fourth slit 516 dof FIG. 5) formed in the third side surface (e.g., the third sidesurface 213 c) of the electronic device 200, with the folded electronicdevice 200 in the user's hand (e.g., the right hand) according to anembodiment of the disclosure.

FIG. 16B is a view illustrating a fourth distance G4 of a slot (e.g.,the third slit 516 c of FIG. 5) formed in the first side surface (e.g.,the first side surface 213 a of FIG. 2) of the electronic device 200 ora first distance H1 of a slot (e.g., the fourth slit 516 d of FIG. 5)formed in a third side surface (e.g., the third side surface 213 c) ofthe electronic device, with the folded electronic device 200 in theuser's hand (e.g., the left hand) according to an embodiment of thedisclosure.

FIG. 17 is a graph illustrating variations in radiation featuredepending on the first, second, third, and fourth distances G1, G2, G3,and G4 of the slits (e.g., the third slit 516 c of FIG. 5) formed in thefirst side surface member (e.g., the first side surface member 501 ofFIG. 2) in the electronic device according to an embodiment of thedisclosure.

Referring to FIG. 16A, the slit 516 c formed in the first side surfaceof the electronic device 200 may be formed in the positions of thefirst, second, third, and fourth distances G1, G2, G3, and G4. Forexample, the first distance G1, the second distance G2, the thirddistance G3, and the fourth distance G4 may be 10 mm, 20 mm, 30 mm, and40 mm, respectively. The slits 516 d formed in the third side surface ofthe electronic device may be formed in the positions of the first,second, third, and fourth distances H1, H2, H3, and H4. For example, thefirst distance H1, the second distance H2, the third distance H3, andthe fourth distance H4 may be 18.5 mm, 28.5 mm, 38.5 mm, and 48.5 mm,respectively.

Referring to FIG. 16B, the fourth distance G4 of the slit 516 c formedin the first side surface of the electronic device 200 may be 40 mm. Thefirst distance H1 of the slit 516 d formed in the third side surface ofthe electronic device 200 may be 18.5 mm.

Referring to FIG. 17, it may be identified that a better radiationefficiency may be secured in the fourth distance G4 of the slit 516 cformed in the first side surface of the electronic device 200 than inthe first, second, and third distances G1, G2, and G3.

FIG. 18 is a view illustrating a configuration of a first and secondside surface member 1501 and 1502 electrically connected with aswitching unit 1300 in a first housing structure (e.g., the firsthousing structure 210 of FIG. 2) of an electronic device (e.g., theelectronic device 200 of FIG. 2) using a coaxial cable according to anembodiment of the disclosure.

FIG. 19 is a view illustrating a configuration of a first and secondside surface member 1501 and 1502 electrically connected with aswitching unit 1300 in a first housing structure 210 of an electronicdevice 200 using a flexible printed circuit board (FPCB) according to anembodiment of the disclosure.

Referring to FIGS. 18 and 19, the first side surface member 1501 may beprovided as part of the first housing structure 210 of FIG. 2, and thesecond side surface member 1502 may be provided as part of the secondhousing structure 220 of FIG. 2. According to an embodiment, the firstside surface member 1501 may include a first side surface portion 1511,a second side surface portion 1512, a third side surface portion 1513, afourth side surface portion 1514, and/or a fifth side surface portion1515. According to an embodiment, the first to fifth side surfaceportions 1511, 1512, 1513, 1514, and 1515 may also be referred to as a‘first to fifth side surface portion partial frame.’ According to anembodiment, the first side surface portion 1511 may be disposed inparallel with the folding axis A. The second side surface portion 1512may be disposed spaced apart from an end (e.g., the top) of the firstside surface portion 1511 in a direction crossing the folding area A orsubstantially perpendicular to the folding area A. The third sidesurface portion 1513 may be disposed spaced apart from the opposite end(e.g., the bottom) of the first side surface portion 1511 in parallelwith the folding area (e.g., the folding area A of FIG. 2). The fourthside surface portion 1514 may be disposed adjacent to an end of thethird side surface portion 1513 and may be disposed spaced apart fromthe third side surface portion 1513 and may extend to the folding area Ain a direction crossing, or in a direction substantially perpendicular.The fifth side surface portion 1515 may extend substantially in parallelwith the folding area A or the first side surface portion 1511. One endof the fifth side surface portion 1515 is disposed spaced apart from anend of the second side surface portion 1512, and the other end of thefifth side surface portion 1515 is disposed spaced apart from an end ofthe fourth side surface portion 1514. According to an embodiment, thefifth side surface portion 515 may be disposed adjacent to the hingestructure or hinge cover (e.g., the hinge structure 264 or hinge cover265 of FIG. 4) and may extend along the folding area A substantially inparallel with the hinge structure 264 or hinge cover 265.

According to an embodiment, the first side surface member 1501 mayinclude a first to fifth slit 1516 a, 1516 b, 1516 c, 1516 d, and 1516 eat least partially separating the electrically conductive materialportions. The first to fifth slits 1516 a, 1516 b, 1516 c, 1516 d, and1516 e may be filled with an insulating material. The first slit 1516 amay be formed between one end of the first side surface portion 1511 andthe second side surface portion 1512, and the second slit 1516 b may beformed between the second side surface portion 1512 and the fifth sidesurface portion 1515. The third slit 516 c may be formed between theopposite end of the first side surface portion 1511 and the third sidesurface portion 1513. The fourth slit 1516 d may be formed between thethird side surface portion 1513 and the fourth side surface portion1514, and the fifth slit 1516 e may be formed between the fourth sidesurface portion 1514 and the fifth side surface portion 1515.

According to an embodiment, a first to fifth connection terminal 1005 a,1005 b, 1005 c, 1005 d, and 1005 e may be formed at the respective firstends of the plurality of first connection members 1005 to beelectrically connected with ground terminals (not shown) formed in thefirst to fifth side surface portions 1511, 1512, 1513, 1514, and 1515,and a first to fifth switch connection terminal 1005 a-1, 1005 b-1, 1005c-1, 1005 d-1, and 1005 e-1 may be formed at the respective second endsof the plurality of first connection members 1005 to be electricallyconnected with switch terminals formed in the switching unit 1300.

According to an embodiment, the second side surface member 1502 mayinclude a sixth side surface portion 1521, a seventh side surfaceportion 1522, an eighth side surface portion 1523, a ninth side surfaceportion 1524, and/or the tenth side surface portion 1525. According toan embodiment, the sixth to tenth side surface portions 1521, 1522,1523, 1524, and 1525 may also be referred to as a ‘sixth to tenth sidesurface portion frame.’ According to an embodiment, at least a portionof the sixth side surface portion 1521 may be disposed in parallel withthe folding area A. The seventh side surface portion 1522 may bedisposed spaced apart from an end (e.g., the top) of the sixth sidesurface portion 1521 in a direction crossing the folding area A orsubstantially perpendicular to the folding area A. The eighth sidesurface portion 1523 may be disposed spaced apart from the opposite end(e.g., the bottom) of the sixth side surface portion 1521 in parallelwith the folding area A. The ninth side surface portion 1524 may bedisposed adjacent to an end of the eighth side surface portion 1523 andmay be disposed spaced apart from the eighth side surface portion 1523and may extend to the folding area A in a direction crossing, or in adirection substantially perpendicular. The tenth side surface portion1525 may extend substantially in parallel with the folding area A. Oneend of the tenth side surface portion 1525 is disposed spaced apart fromthe an end of the seventh side surface portion 1522, and the other endof the tenth side surface portion 1525 is disposed spaced apart from anend of the ninth side surface portion 1524 According to an embodiment,the tenth side surface portion 1525 may be disposed adjacent to thehinge structure or hinge cover (e.g., the hinge structure 264 or hingecover 265 of FIG. 4) and may extend along the folding area Asubstantially in parallel with the hinge structure or hinge cover.

According to an embodiment, the second side surface member 1502 mayinclude the sixth to tenth slits 1526 a, 1526 b, 1526 c, 1526 d, and1526 e, which at least part separate the electrically conductivematerial portions, and the sixth to tenth slits 1526 a, 1526 b, 1526 c,1526 d, and 1526 e may be filled with an insulating material.

According to an embodiment, the sixth slit 1526 a may be formed betweenone end of the sixth side surface portion 1521 and the seventh sidesurface portion 1522, and the seventh slit 1526 b may be formed betweenthe seventh side surface portion 1522 and the tenth side surface portion1525. The eighth slit 1526 c may be formed between the opposite end ofthe sixth side surface portion 1521 and the eighth side surface portion1523. The ninth slit 1526 d may be formed between the eighth sidesurface portion 1523 and the ninth side surface portion 1524, and thetenth slit 1526 e may be formed between the ninth side surface portion1524 and the tenth side surface portion 1525.

According to an embodiment, a sixth to tenth connection terminal 1006 a,1006 b, 1006 c, 1006 d, and 1006 e may be formed at the respective firstends of the plurality of second connection members 1006 to beelectrically connected with ground terminals (not shown) formed in thesixth to tenth side surface portions 1521, 1522, 1523, 1524, and 1525,and a sixth to tenth switch connection terminal 1006 a-1, 1006 b-1, 1006c-1, 1006 d-1, and 1006 e-1 may be formed at the respective second endsof the plurality of second connection members 1006 to be electricallyconnected with switch terminals formed in the switching unit 1300.

FIGS. 18 and 19 illustrate a configuration of an antenna device 1500 inan electronic device (e.g., the electronic device 200 of FIG. 2), e.g.,the in the plurality of housing structures 210 and 220 and hingestructure (e.g., the hinge structure 264 of FIG. 4) supporting onedisplay (e.g., the display 230 of FIG. 4), according to an embodiment.

Referring to FIGS. 18 and 19, the antenna device 1500 may include thefirst side surface member 1501 and the second side surface member 1502.For example, the first side surface member 1501 may include at least onefirst radiation conductor 1001 and at least one second radiationconductor 1002, and the second side surface member 1502 may include atleast one third radiation conductor 1003 and at least one fourthradiation conductor 1004. For example, the at least one first radiationconductor 1001 may be formed of the third side surface portion 1513 andthe fourth side surface portion 1514, and the at least one secondradiation conductor 1002 may be formed of the first side surface portion1511, the second side surface portion 1512, and the fifth side surfaceportion 1515. For example, the at least one third radiation conductor1003 may be formed of the eighth side surface portion 1523 and the ninthside surface portion 1524, and the at least one fourth radiationconductor 1004 may be formed of the sixth side surface portion 1521, theseventh side surface portion 1522, and the tenth side surface portion1525.

According to an embodiment, a plurality of first connection members 1005may be disposed in at least part of the first housing structure 210 toelectrically connect the at least one first radiation conductor 1001 andthe at least one second radiation conductor 1002 with the switching unit1300. A plurality of second connection members 1006 may be disposed inat least part of the first and second housing structures 210 and 220 andat least part of the hinge structure 264 to electrically connect the atleast one third radiation conductor 1003 and the at least one fourthradiation conductor 1004 with the switching unit 1300. For example, theswitching unit 1300 may be disposed in the first housing structure 210.As another example, the switching unit 1300 may be disposed in acommunication module 1200 described below. For example, the switchingunit 1300 may be disposed inside or outside the communication module1200. In this state, the plurality of second connection members 1006 mayelectrically connect the at least one third radiation conductor 1003 andthe at least one fourth radiation conductor 1004 with the switching unit1300, disposed in the second housing structure 220. In this case, theplurality of second connection members 1006 may be electricallyconnected with the switching unit 1300 via the hinge structure 264.

At least part of the at least one first to fourth radiation conductor1001, 1002, 1003, and 1004 may be formed of an electrically conductivematerial. For example, the at least one first to fourth radiationconductor 1001, 1002, 1003, and 1004 may function as an antenna radiator(e.g., a radiation conductor) of the electronic device (e.g., theelectronic device 200 of FIG. 2). For example, in the plurality ofhousing structures 210 and 220 and hinge structure (e.g., the hingestructure 264 of FIG. 4) supporting one display (e.g., the display 230of FIG. 4), the processor 1400 or communication module 1200 (e.g., theprocessor 120 or communication module 190 of FIG. 1) of the electronicdevice 200 may transmit/receive radio signals using part of the at leastone first to fourth radiation conductor 1001, 1002, 1003, and 1004. Thecommunication module 1200 may perform wireless communication between theelectronic device 200 and an external electronic device (e.g., theexternal electronic devices 102 or 104 of FIG. 1).

The at least one first radiation conductor 1001 and the at least onethird radiation conductor 1003 may be formed of a main antenna, and theat least one second radiation conductor and the at least one fourthradiation conductor 1004 may be formed of a sub antenna.

For example, the main antenna may include at least one of an LTEcommunication antenna or 3G, 4G, and 5G communication antenna. The subantenna may include at least one of a Wi-Fi antenna for wireless LANcommunication, a Bluetooth antenna or Zigbee antenna for short-rangewireless communication, a wireless charging antenna for wirelesslycharging the battery, a broadcast communication antenna, and a globalpositioning system (GPS) antenna.

According to an embodiment, the plurality of first and second connectionmembers 1005 and 1006 may include at least one of a coaxial cable, aflexible printed circuit board (FPCB), a micro strip line, or a stripline. According to an embodiment, although the plurality of first andsecond connection members 1005 and 1006 include a coaxial cable, FPCB,micro strip line, or strip line, as an example, embodiments of thedisclosure are not limited thereto. For example, as the plurality offirst and second connection members 1005 and 1006, any other variouscomponents may be used which may electrically connect the at least onefirst to fourth radiation conductor 1001, 1002, 1003, and 1004 with theswitching unit 1300.

According to an embodiment, as described above in connection with FIG.18, as the plurality of first and second connection members 1005 and1006 are formed of coaxial cables, the radiation feature of antenna maybe enhanced in the plurality of housing structures 210 and 220 and hingestructure (e.g., the hinge structure 264 of FIG. 4) supporting onedisplay (e.g., the display 230 of FIG. 4). This may enhance thefunction, as a radiator, of at least one first to fourth radiationconductor 1001, 1002, 1003, and 1004.

According to an embodiment, as the plurality of first and secondconnection members 2005 and 2006 are formed of FPCBs as described abovein connection with FIG. 19, the plurality of first and second connectionmembers 2005 and 2006 may be prevented from damage due to repetitivefolding or unfolding of the first and second housing structures (e.g.,the first and second housing structures 210 and 220 of FIG. 2). Forexample, at least part of the plurality of second connection members2006 formed of an FPCB may be disposed in the folded portion of thehinge structure 264 and, in this state, the plurality of secondconnection members 1006 may be prevented from damage in the foldedportion of the hinge structure 264 when the first and second housingstructures (e.g., the first and second housing structures 210 and 220 ofFIG. 2) are repetitively folded or unfolded. Thus, the electricalconnection between the at least one third radiation conductor 1003 andthe at least one fourth radiation conductor 1004 and the switching unit1300 may be enhanced.

FIG. 20 is a view illustrating a configuration of a first and secondside surface member 1501 and 1502 electrically connected with aswitching unit 1300 in a first housing structure of an electronic device(e.g., the electronic device 200 of FIG. 2) using a coaxial cable andflexible printed circuit board according to an embodiment of thedisclosure.

The electronic device 200 may be identical or similar in at leastpartial configuration to the above-described electronic device (e.g.,the electronic device 200 of FIG. 2). Thus, at least one of thecomponents of the electronic device 200 may be the same or similar to atleast one of the components of the electronic device 200 of FIG. 2 andno duplicate description is made below.

Referring to FIG. 20, the first housing structure (e.g., the firsthousing structure 210 of FIG. 2) may have a plurality of thirdconnection members 1007, which electrically connect the at least onefirst radiation conductor 1001 and the at least one second radiationconductor 1002 with the switching unit 1300, disposed, and the secondhousing structure (e.g., the second housing structure 220 of FIG. 2) mayhave a plurality of fourth connection members 1008, which electricallyconnect the at least one third radiation conductor 1003 and the at leastone fourth radiation conductor 1004 with the switching unit 1300,disposed. A plurality of fifth connection members 1009 whichelectrically connect the plurality of fourth connection members 1008 andthe switching unit 1300 may be disposed in at least part of the firstand second housing structures 210 and 220 and at least part of the hingestructure 264. For example, the plurality of third connection members1007 may be disposed in the first housing structure 210 and, in thisstate, the plurality of fourth connection members 1008 may be disposedin the second housing structure 220, and the plurality of fifthconnection members 1009 may be disposed in at least part of the hingestructure 264.

According to an embodiment, a first to fifth connection terminal 1007 a,1007 b, 1007 c, 1007 d, and 1007 e may be formed at the respective firstends of the plurality of third connection members 1007 to beelectrically connected with ground terminals (not shown) formed in thefirst to fifth side surface portions 1511, 1512, 1513, 1514, and 1515,and a first to fifth switch connection terminal 1007 a-1, 1007 b-1, 1007c-1, 1007 d-1, and 1007 e-1 may be formed at the respective second endsof the plurality of third connection members 1007 to be electricallyconnected with switch terminals formed in the switching unit 1300.

A sixth to tenth connection terminal 1008 a, 1008 b, 1008 c, 1008 d, and1008 e may be formed at the respective first ends of the plurality offourth connection members 1008 to be electrically connected with groundterminals formed in the sixth to tenth side surface portions 1521, 1522,1523, 1524, and 1525, and an eleventh to fifteenth connection terminal1008 a-1, 1008 b-1, 1008 c-1, 1008 d-1, and 1008 e-1 may be formed atthe respective second ends of the plurality of fourth connection members1008 to be electrically connected with the sixteenth to twentiethconnection terminals 1009 a, 1009 b, 1009 c, 1009 d, and 1009 edescribed below.

The sixteenth to twentieth connection terminals 1009 a, 1009 b, 1009 c,1009 d, and 1009 e may be formed at the respective first ends of theplurality of fifth connection members 1009 to be electrically connectedwith the eleventh to fifteenth connection terminals 1008 a-1, 1008 b-1,1008 c-1, 1008 d-1, and 1008 e-1 of the plurality of fourth connectionmembers 1008, and a twenty first to twenty fifth switch connectionterminal 1009 a-1, 1009 b-1, 1009 c-1, 1009 d-1, and 1009 e-1 may beformed at the respective second ends of the plurality of fifthconnection members 1009 to be electrically connected with switchterminals formed in the switching unit 1300.

According to an embodiment, the plurality of third and fourth connectionmembers 1007 and 1008 may be formed of a coaxial cable, and theplurality of fifth connection members may be formed of a flexibleprinted circuit board (FPCB).

For example, placing the plurality of third and fourth connectionmembers 1007 and 1008 formed of a coaxial cable in the first and secondhousing structures 210 and 220 may enhance electrical connection betweenthe at least one first radiation conductor 1001 and the at least onesecond radiation conductor 1002 and the switching unit 1300, as well asthe radiation feature of antenna.

The plurality of fifth connection members 1009 formed of an FPCB may bedisposed in the folded portion of the hinge structure 264 and, thus, theplurality of fifth connection members 1009 may be prevented from damagedespite repetitive folding or unfolding of the first and second housingstructures 210 and 220. By preventing damage to the plurality of fifthconnection members 1009 formed of an FPCB, the electrical connectionbetween the at least one third radiation conductor 1003 and the at leastone fourth radiation conductor 1004 and the switching unit 1300 may beenhanced.

As such, the plurality of third and fourth connection members 1007 and1008 formed of a coaxial cable are disposed in the first and secondhousing structures 210 and 220, and the plurality of fifth connectionmembers 1009 formed of an FPCB are disposed in the folded portion of thehinge structure 264, it is possible to enhance the electrical connectionbetween the at least one first to fourth radiation conductor 1001, 1002,1003, and 1004 and the switching unit 1300 in the plurality of housingstructures 210 and 220 and hinge structure (e.g., the hinge structure264 of FIG. 4) supporting one display (e.g., the display 230 of FIG. 4)and thus enhance the function, as an antenna, of the at least one firstto fourth radiation conductor 1001, 1002, 1003, and 1004 while securingstable antenna performance. Further, the plurality of fifth connectionmembers 1009 formed of an FPCB may be disposed in the folded portion ofthe hinge structure 264 and, in this state, the fifth connection members1009 may be prevented from damage in the folded portion of the hingestructure 264 when the first and second housing structures 210 and 220are repetitively folded or unfolded. Thus, the plurality of fifthconnection members 1009 formed of an FPCB may enhance, and keep stable,the electrical connection between the switching unit 1300 and the atleast one first to fourth radiation conductor 1001, 1002, 1003, and1004.

FIG. 21 is a view illustrating a hand gripped state of a second housingstructure (e.g., the second housing structure 220 of FIG. 2) amongcomponents of an electronic device (e.g., the electronic device 200 ofFIG. 2) according to an embodiment of the disclosure.

FIG. 22 is a view illustrating a hand gripped state of a first housingstructure (e.g., the first housing structure 210 of FIG. 2) amongcomponents of an electronic device (e.g., the electronic device 200 ofFIG. 2) according to an embodiment of the disclosure.

FIG. 23 is a view illustrating a hand gripped state of both a first andsecond housing structure (e.g., the first and second housing structures210 and 220 of FIG. 2) among components of an electronic device 200according to an embodiment of the disclosure.

Referring to FIGS. 21 through 23, the electronic device 200 may includethe first housing structure 210, the second housing structure 220, and ahinge structure (e.g., the hinge structure 264 of FIG. 4). The firsthousing structure 210 and the second housing structure 220 may rotate onthe hinge structure (e.g., the hinge structure 264 of FIG. 4), operatingin the unfolded state or folded state in the plurality of housingstructures 210 and 220 and hinge structure (e.g., the hinge structure264 of FIG. 4) supporting one display (e.g., the display 230 of FIG. 4).

At least one of the components of the electronic device 200 may be thesame or similar to at least one of the components of the antenna device1500 of FIGS. 18 through 20 and no duplicate description is made below.

Further, as described above in connection with FIGS. 18 through 20, theelectronic device 200 may include the at least one first to fourthradiation conductor 1001, 1002, 1003, and 1004, a sensor unit 1100, acommunication module 1200, a switching unit 1300, a processor 1400, anda memory 1401.

The sensor unit 1100 may detect the operation state of the electronicdevice 200 and convert the detected information into an electricalsignal. For example, the sensor unit 1100 may include at least one of agrip sensor and a proximity sensor. The proximity sensor may detectwhether to approach the electronic device 200, e.g., approach of anexternal object (e.g., the user's finger or a stylus) on the display(e.g., the display 230 of FIG. 4) of the electronic device 200.

The grip sensor may detect holding or gripping the electronic device 200in an external object (e.g., the user's hand) The grip sensor may bedisposed in at least one of the left/right side surfaces, top/bottomsurfaces, or back surface of the first and second housing structures 210and 220 of the electronic device 200. The grip sensor may transfer theobtained sensor information to the processor 1400.

According to an embodiment, if the user's body touches the electronicdevice 200, the grip sensor may detect a variation in capacitance of theelectronic device 200, thereby sensing the user's body touch. Thus, thegrip sensor, as a separate sensor for detecting the user's body touch,may be mounted in the electronic device 200, or the grip sensor, as anon-separate sensor, may be implemented to detect variations incapacitance of the first and second housing structures 210 and 220(e.g., a metal housing) of the electronic device 200.

According to an embodiment, such a grip sensor is described as anexample.

For example, in the plurality of housing structures 210 and 220 andhinge structure 264 supporting one display (e.g., the display 230 ofFIG. 4), the communication module 1200 may be electrically connectedwith the at least one first to fourth radiation conductor 1001, 1002,1003, and 1004 to transmit/receive radio signals.

The switching unit 1300 may electrically connect the communicationmodule 1200 with the at least one first to fourth radiation conductor1001, 1002, 1003, and 1004.

The processor 1400 may detect a hand grip on the first housing structure210 and/or the second housing structure 220, via the sensor unit 1100,in the unfolded state or folded state of the first and second housingstructures 210 and 220 and control the switching unit 1300 to switchfrom the at least one first or second radiation conductor 1001 or 1002to the at least one third or fourth radiation conductor 1003 or 1004 orfrom the at least one third or fourth radiation conductor 1003 or 1004to the at least one first or second radiation conductor 1001 or 1002.

The memory 1401 may store a switch control program for controlling theswitching unit 1300. For example, the switch control program may storedata to control the switching unit 1300 to switch the at least one firstto fourth radiation conductor 1001, 1002, 1003, and 1004. For example,the switch control program may store data for adjustment to switch fromthe at least one first or second radiation conductor 1001 or 1002 to theat least one third or fourth radiation conductor 1003 or 1004 or fromthe at least one third or fourth radiation conductor 1003 or 1004 to theat least one first or second radiation conductor 1001 or 1002 dependingon the hand grip on the first and second housing structures 210 and 220.

When the first housing structure 210 is hand-gripped in the unfoldedstate of the first housing structure 210 and the second housingstructure 220, the processor 1400 may detect the hand grip via thesensor unit 1100 and control the switching unit 1300 to switch from theat least one first or second radiation conductor 1001 or 1002 of thefirst housing structure 210 to the at least one third or fourthradiation conductor 1003 or 1004 of the second housing structure 220. Inthis case, the at least one first or second radiation conductor 1001 or1002 of the first housing structure 210 may experience a lowering inradiation performance due to the user's hand grip. However, since the atleast one third or fourth radiation conductor 1003 or 1004 of the secondhousing structure 220 is not in the user's hand grip, the at least onethird or fourth radiation conductor 1003 or 1004 may be prevented from alowering in radiation performance due to influence by the human body.Thus, the electronic device 200 may select the at least one third orfourth radiation conductor 1003 or 1004 by the switching unit 1300 anduse it as an antenna.

According to an embodiment, when the second housing structure 220 ishand-gripped in the unfolded state of the first housing structure (e.g.,the first housing structure 210 of FIG. 2) and the second housingstructure (e.g., the second housing structure 220 of FIG. 2), theprocessor 1400 may detect the hand grip via the sensor unit 1100 andcontrol the switching unit 1300 to switch from the at least one third orfourth radiation conductor 1003 or 1004 of the second housing structure220 to the at least one first or second radiation conductor 1001 or 1002of the first housing structure 210, as described above in connectionwith FIGS. 18 through 20 and FIG. 22. The at least one third or fourthradiation conductor 1003 or 1004 of the second housing structure 220may, likewise, experience a lowering in radiation performance due to theuser's hand grip. However, since the at least one first or secondradiation conductor 1001 or 1002 of the first housing structure 210 isnot in the user's hand grip, it may be prevented from a lowering inradiation performance due to influence by the human body. Thus, theelectronic device 200 may select the at least one first or secondradiation conductor 1001 or 1002 by the switching unit 1300 and use itas an antenna, thereby securing the antenna's stable functioning.

According to an embodiment, when both the first and second housingstructures 210 and 220 are hand-gripped in the unfolded state of thefirst housing structure (e.g., the first housing structure 210 of FIG.2) and the second housing structure (e.g., the second housing structure220 of FIG. 2), the processor 1400 may detect the hand grip via thesensor unit 1100 and control the switching unit 1300 to switch to the atleast one first or second radiation conductor 1001 or 1002 of the firsthousing structure 210, as described above in connection with FIGS. 18through 20 and FIG. 23. For example, the at least one first or secondradiation conductor 1001 or 1002 may be electrically connected with theswitching unit 1300 via the plurality of first connection members 1005,and the at least one third or fourth radiation conductor 1003 or 1004may be electrically connected with the switching unit 1300 via theplurality of second connection members 1006. The length F1 or F2 of theplurality of first connection members 1005 may be smaller than thelength F3 or F4 of the plurality of second connection members 1006.

For example, as the length F1 or F2 of the plurality of first connectionmembers 1005 is smaller than the length F3 or F4 of the plurality ofsecond connection members 1006, the plurality of first connectionmembers 1005 may result in smaller antenna radiation loss than theplurality of second connection members 1006 in the plurality of housingstructures 210 and 220 and hinge structure 264 supporting one display(e.g., the display 230 of FIG. 4). Thus, the at least one first orsecond radiation conductor 1001 or 1002 may present more stableradiation performance than the at least one third or fourth radiationconductor. Thus, the processor 1400 may control the switching unit 1300to select the at least one first or second radiation conductor 1001 or1002 of the first housing structure 210. Thus, with both the first andsecond housing structures 210 and 220 hand-gripped, the at least onefirst or second radiation conductor 1001 or 1002 may be used as anantenna. Thus, the electronic device 200 may secure a stable antennaperformance using the at least one first or second radiation conductor1001 or 1002 as an antenna.

According to an embodiment, when both the first and second housingstructures 210 and 220 are hand-gripped in the unfolded state of thefirst housing structure (e.g., the first housing structure 210 of FIG.2) and the second housing structure (e.g., the second housing structure220 of FIG. 2), the processor 1400 may detect the hand grip via thesensor unit 1100 and control the switching unit 1300 to switch to the atleast one first or second radiation conductor 1001 or 1002 of the firsthousing structure, as described above in connection with FIG. 16B andFIGS. 18 through 20. For example, the at least one first or secondradiation conductor 1001 or 1002 may be electrically connected with theswitching unit 1300 via the plurality of first connection members 1005,and the at least one third or fourth radiation conductor 1003 or 1004may be electrically connected with the switching unit 1300 via theplurality of second connection members 1006. As the length F1 or F2 ofthe plurality of first connection members 1005 is smaller than thelength F3 or F4 of the plurality of second connection members 1006, theplurality of first connection members 1005 may result in smaller antennaradiation loss than the plurality of second connection members 1006.Thus, the at least one first or second radiation conductor 1001 or 1002may present more stable radiation performance than the at least onethird or fourth radiation conductor. Thus, the processor 1400 maycontrol the switching unit 1300 to select the at least one first orsecond radiation conductor 1001 or 1002 of the first housing structure210. Thus, the at least one first or second radiation conductor 1001 or1002 may be used as an antenna, with the folded first and second housingstructures 210 and 220 hand-gripped.

As such, although the first and second housing structures 210 and 220both are hand-gripped in the unfolded state of the first and secondhousing structures 210 and 220 in the plurality of housing structures210 and 220 and hinge structure 264 supporting one display (e.g., thedisplay 230 of FIG. 4), the electronic device 200 may secure a stableantenna performance using the at least one first or second radiationconductor 1001 or 1002 as an antenna.

According to an embodiment, an electronic device (e.g., the electronicdevice 200 of FIG. 2) with an antenna device (e.g., the antenna device500 of FIG. 6) comprises a first housing structure (e.g., the firsthousing structure 210 of FIG. 2) including a first surface facing in afirst direction, a second surface facing in a second direction oppositeto the first direction, and a first side surface member (e.g., the firstside surface member 501 of FIG. 5) at least partially surrounding aspace between the first surface and the second surface, the firsthousing structure (e.g., the first housing structure 210 of FIG. 2) atleast partially formed of an electrically conductive material, a secondhousing structure (e.g., the second housing structure 220 of FIG. 2)including a third surface facing in a third direction, a fourth surfacefacing in a fourth direction opposite to the third direction, and asecond side surface member (e.g., the second side surface member 502 ofFIG. 5) at least partially surrounding a space between the third surfaceand the fourth surface, the second housing structure (e.g., the secondhousing structure 220 of FIG. 2) at least partially formed of anelectrically conductive material, a hinge structure (e.g., the hingestructure 264 of FIG. 4) rotatably connecting the first housingstructure (e.g., the first housing structure 210 of FIG. 2) and thesecond housing structure (e.g., the second housing structure 220 of FIG.2) and providing a folding axis (e.g., A of FIG. 5) on which the firsthousing structure (e.g., the first housing structure 210 of FIG. 2) andthe second housing structure (e.g., the second housing structure 220 ofFIG. 2) rotate, and at least one printed circuit board disposed betweenthe first surface and the second surface or between the third surfaceand the fourth surface, wherein the first side surface member (e.g., thefirst side surface member 501 of FIG. 5) and the second side surfacemember (e.g., the second side surface member 502 of FIG. 5) includes afirst side surface portion (e.g., the first side surface portion 511 ofFIG. 5) disposed in parallel with the folding axis (e.g., A of FIG. 5),a second side surface portion (e.g., the second side surface portion 512of FIG. 5) extending from an end of the first side surface portion(e.g., the first side surface portion 511 of FIG. 5) in a directioncrossing the folding axis (e.g., A of FIG. 5), a third side surfaceportion (e.g., the third side surface portion 513 of FIG. 5) extendingfrom another end of the first side surface portion (e.g., the first sidesurface portion 511 of FIG. 5) in parallel with the folding axis (e.g.,A of FIG. 5), a fourth side surface portion (e.g., the fourth sidesurface portion 514 of FIG. 5) connected with the third side surfaceportion (e.g., the third side surface portion 513 of FIG. 5) andextending from the third side surface portion (e.g., the third sidesurface portion 513 of FIG. 5) in a direction crossing the folding axis(e.g., A of FIG. 5), a fifth side surface portion (e.g., the fifth sidesurface portion 515 of FIG. 5) connecting the second side surfaceportion (e.g., the second side surface portion 512 of FIG. 5) and thefourth side surface portion (e.g., the fourth side surface portion 514of FIG. 5) and extending in parallel with the folding axis (e.g., A ofFIG. 5), the fifth side surface portion (e.g., the fifth side surfaceportion 515 of FIG. 5) disposed adjacent to the hinge structure (e.g.,the hinge structure 264 of FIG. 4), a first slit (e.g., the first slit516 a of FIG. 5) formed between an end of the first side surface portion(e.g., the first side surface portion 511 of FIG. 5) and the second sidesurface portion (e.g., the second side surface portion 512 of FIG. 5), asecond slit (e.g., the second slit 516 b of FIG. 5) formed between thesecond side surface portion (e.g., the second side surface portion 512of FIG. 5) and the fifth side surface portion (e.g., the fifth sidesurface portion 515 of FIG. 5), a third slit (e.g., the third slit 516 cof FIG. 5) formed between another end of the first side surface portion(e.g., the first side surface portion 511 of FIG. 5) and the third sidesurface portion (e.g., the third side surface portion 513 of FIG. 5),and a fourth slit (e.g., the fourth slit 516 d of FIG. 5) formed betweenthe third side surface portion (e.g., the third side surface portion 513of FIG. 5) and the fourth side surface portion (e.g., the fourth sidesurface portion 514 of FIG. 5), and a fifth slit (e.g., the fifth slit516 e of FIG. 5) formed between the fourth side surface portion (e.g.,the fourth side surface portion 514 of FIG. 5) and the fifth sidesurface portion (e.g., the fifth side surface portion 515 of FIG. 5),and wherein at least part of at least one of the second side surfaceportion (e.g., the second side surface portion 512 of FIG. 5), the thirdside surface portion (e.g., the third side surface portion 513 of FIG.5), and the fourth side surface portion (e.g., the fourth side surfaceportion 514 of FIG. 5) is formed of a radiation conductor and iselectrically connected to the printed circuit board.

According to an embodiment, the third side surface portion may include afirst portion formed in a first length along a direction parallel withthe folding axis and a second portion connected with the first portionand formed in a second length along a direction crossing the foldingaxis.

According to an embodiment, the first portion may be longer than thesecond portion.

According to an embodiment, the third slit may be formed within adistance not less than 30 mm and not more than 50 mm from the secondportion of the third side surface portion in a direction parallel withthe folding axis.

According to an embodiment, the first length may range from 30 mm to 50mm, and the second length may range from 8.6 mm to 28.6 mm.

According to an embodiment, the third side surface portion may include aground terminal, a power supply terminal, and a switch terminal, andwherein the ground terminal may be provided in the third side surfaceportion to be electrically connected with a ground portion included inthe printed circuit board in a position adjacent to the fourth slit, thepower supply terminal may be provided in the third side surface portionto be electrically connected with a power supply portion included in theprinted circuit board between the ground terminal and the switchterminal, and the switch terminal may be provided in the third sidesurface portion to be electrically connected with a switch portionincluded in the printed circuit board in a position adjacent to thepower supply terminal.

According to an embodiment, the fourth side surface portion may includea power supply terminal, and wherein the power supply terminal may beprovided in the fourth side surface portion to be electrically connectedwith a power supply portion included in the printed circuit board in aposition adjacent to the fourth slit.

According to an embodiment, the first, second, third, fourth, and fifthslits may be filled with an insulating material.

According to an embodiment, the first housing structure and the secondhousing structure may be rotated on the hinge structure to be folded toallow the first surface to face the third surface or to allow the firstsurface to be positioned side by side, wherein in the folded positionwhere the first surface faces the third surface, the first, second,third, fourth, and fifth slits of the first side surface member of thefirst housing structure adjacently face the first, second, third,fourth, and fifth slits of the second side surface member of the secondhousing structure, and in the position where the first surface and thethird surface may be disposed side by side, the first, second, third,fourth, and fifth slits of the first side surface member of the firsthousing structure may be symmetrical with the first, second, third,fourth, and fifth slits of the second side surface member of the secondhousing structure with respect to the folding axis.

According to an embodiment, an electronic device (e.g., the electronicdevice 200 of FIG. 2) with an antenna device (e.g., the antenna device500 of FIG. 2) comprises a first housing structure including a firstsurface facing in a first direction, a second surface facing in a seconddirection opposite to the first direction, and a first side surfacemember at least partially surrounding a space between the first surfaceand the second surface, the first housing structure at least partiallyformed of an electrically conductive material, a second housingstructure including a third surface facing in a third direction, afourth surface facing in a fourth direction opposite to the thirddirection, and a second side surface member at least partiallysurrounding a space between the third surface and the fourth surface,the second housing structure at least partially formed of anelectrically conductive material, a hinge structure rotatably connectingthe first housing structure and the second housing structure andproviding a folding axis on which the first housing structure and thesecond housing structure rotate, and at least one printed circuit boarddisposed between the first surface and the second surface or between thethird surface and the fourth surface, wherein the first side surfacemember (e.g., the first side surface member 501 of FIG. 5) may include afirst side surface portion (e.g., the first side surface portion 511 ofFIG. 5) disposed in parallel with the folding axis, a second sidesurface portion (e.g., the second side surface portion 512 of FIG. 5)extending from an end of the first side surface portion in a directioncrossing the folding axis, a third side surface portion extending fromanother end of the first side surface portion in parallel with thefolding axis, a fourth side surface portion (e.g., the fourth sidesurface portion 514 of FIG. 5) connected with the third side surfaceportion and extending from the third side surface portion in a directioncrossing the folding axis, a fifth side surface portion (e.g., the fifthside surface portion 515 of FIG. 5) connecting the second side surfaceportion and the fourth side surface portion and extending in parallelwith the folding axis, the fifth side surface portion disposed adjacentto the hinge structure, a first slit (e.g., the first slit 516 a of FIG.5) formed between an end of the first side surface portion and thesecond side surface portion, a second slit (e.g., the second slit 516 bof FIG. 5) formed between the second side surface portion and the fifthside surface portion, a third slit (e.g., the third slit 516 c of FIG.5) formed between another end of the first side surface portion and thethird side surface portion, and a fourth slit (e.g., the fourth slit 516d of FIG. 5) formed between the third side surface portion and thefourth side surface portion, and a fifth slit (e.g., the fifth slit 516e of FIG. 5) formed between the fourth side surface portion and thefifth side surface portion, and the second side surface member (e.g.,the second side surface member 502 of FIG. 5) may include a sixth sidesurface portion (e.g., the sixth side surface portion 521 of FIG. 5)disposed in parallel with the folding axis, a seventh side surfaceportion (e.g., the seventh side surface portion 522 of FIG. 5) extendingfrom an end of the sixth side surface portion in a direction crossingthe folding axis, an eighth side surface portion (e.g., the eighth sidesurface portion 523 of FIG. 5) extending from another end of the sixthside surface portion in parallel with the folding axis, a ninth sidesurface portion (e.g., the ninth side surface portion 524 of FIG. 5)connected with the eighth side surface portion and extending from theeighth side surface portion in a direction crossing the folding axis, atenth side surface portion (e.g., the tenth side surface portion 525 ofFIG. 5) connecting the seventh side surface portion and the ninth sidesurface portion and extending in parallel with the folding axis, thetenth side surface portion disposed adjacent to the hinge structure, asixth slit (e.g., the sixth slit 526 a of FIG. 5) formed between an endof the sixth side surface portion and the seventh side surface portion,a seventh slit (e.g., the seventh slit 526 b of FIG. 5) formed betweenthe seventh side surface portion and the tenth side surface portion, aneighth slit (e.g., the eighth slit 526 c of FIG. 5) formed betweenanother end of the sixth side surface portion and the eighth sidesurface portion, a ninth slit (e.g., the ninth slit 526 d of FIG. 5)formed between the eighth side surface portion and the ninth sidesurface portion, and a tenth slit (e.g., the tenth slit 526 e of FIG. 5)formed between the ninth side surface portion and the tenth side surfaceportion, and wherein at least part of at least one of the second sidesurface portion, the third side surface portion, and the fourth sidesurface portion may be formed of a radiation conductor and may beelectrically connected to the printed circuit board, and at least partof at least one of the seventh side surface portion, the eighth sidesurface portion, and the ninth side surface portion may be formed of aradiation conductor and may be electrically connected to the printedcircuit board.

According to an embodiment, the third side surface portion may include afirst portion formed in a predetermined first length L1 along adirection parallel with the folding axis and a second portion connectedwith the first portion and formed in a predetermined second length L2along a direction crossing the folding axis, and the eighth side surfaceportion may include a third portion formed in a predetermined thirdlength L3 along a direction parallel with the folding axis and a fourthportion connected with the third portion and formed in a predeterminedfourth length L4 along a direction crossing the folding axis.

According to an embodiment, the first portion may be longer than thesecond portion, and the third portion may be longer than the fourthportion.

According to an embodiment, the third slit may be formed within adistance D1 not less than 30 mm and not more than 50 mm from the secondportion of the third side surface portion in a direction parallel withthe folding axis, and the eighth slit may be formed within a distance D2not less than 30 mm and not more than 50 mm from the fourth portion ofthe eighth side surface portion in a direction parallel with the foldingaxis.

According to an embodiment, the predetermined first length L1 and thepredetermined third length L3 may range from 30 mm to 50 mm, and thepredetermined second length L2 and the predetermined fourth length L4may range from 8.6 mm to 28.6 mm.

According to an embodiment, the eighth side surface portion may includea ground terminal, a power supply terminal, and a switch terminal, andwherein the ground terminal may be provided in the eighth side surfaceportion to be electrically connected with a ground portion included inthe printed circuit board in a position adjacent to the ninth slit, thepower supply terminal may be provided in the eighth side surface portionto be electrically connected with a power supply portion included in theprinted circuit board between the ground terminal and the switchterminal, and the switch terminal may be provided in the eighth sidesurface portion to be electrically connected with a switch portionincluded in the printed circuit board in a position adjacent to thepower supply terminal.

According to an embodiment, the ninth side surface portion may include apower supply terminal, and wherein the power supply terminal may beprovided in the ninth side surface portion to be electrically connectedwith a power supply portion included in the printed circuit board in aposition adjacent to the ninth slit.

According to an embodiment, the first, second, third, fourth, fifth,sixth, seventh, eighth, ninth, and tenth slits may be filled with aninsulating material.

According to an embodiment, the first housing structure and the secondhousing structure may be rotated on the hinge structure to be folded toallow the first surface to face the third surface or to allow the firstsurface to be positioned side by side, wherein in the folded positionwhere the first surface faces the third surface, the first, second,third, fourth, and fifth slits of the first side surface member of thefirst housing structure adjacently face the sixth, seventh, eighth,ninth, and tenth slits of the second side surface member of the secondhousing structure, and in the position where the first surface and thethird surface may be disposed side by side, the first, second, third,fourth, and fifth slits of the first side surface member of the firsthousing structure may be symmetrical with the sixth, seventh, eighth,ninth, and tenth slits of the second side surface member of the secondhousing structure with respect to the folding axis.

According to an embodiment, an electronic device (e.g., the electronicdevice 200 of FIG. 2) with an antenna device (e.g., the antenna device1500 of FIG. 18) comprises a first housing structure (e.g., the firsthousing structure 210 of FIG. 2) including a first side surface member,a second housing structure (e.g., the second housing structure 220 ofFIG. 2) including a second side surface member, and a hinge structure(e.g., the hinge structure 264 of FIG. 4) rotatably connecting the firsthousing structure and the second housing structure and providing afolding axis (e.g., the folding axis A of FIG. 5) on which the firsthousing structure and the second housing structure rotate, wherein thefirst side surface member (e.g., the first side surface member 1501 ofFIG. 18) may include at least one first radiation conductor and at leastone second radiation conductor, and the second side surface member(e.g., the second side surface member 1502 of FIG. 18) may include atleast one third radiation conductor and at least one fourth radiationconductor, wherein a plurality of first connection members (e.g., theplurality of first connection members 1005 of FIG. 18) may be disposedin at least part of the first housing structure to electrically connectthe at least one first radiation conductor (e.g., the at least one firstradiation conductor 1001 of FIG. 18) and the at least one secondradiation conductor (e.g., the second radiation conductor 1002 of FIG.18) with a switching unit (e.g., the switching unit 1300 of FIG. 18)disposed in the first housing structure, and a plurality of secondconnection members (e.g., the plurality of second connection members1006 of FIG. 18) may be disposed in at least part of the first andsecond housing structures and at least part of the hinge structure toelectrically connect the at least one third radiation conductor (e.g.,the third radiation conductor 1003 of FIG. 18) and the at least onefourth radiation conductor (e.g., the fourth radiation conductor 1004 ofFIG. 18) with the switching unit (e.g., the switching unit 1300 of FIG.18).

According to an embodiment, the first side surface member (e.g., thefirst side surface member 1501 of FIG. 18) may include a first sidesurface portion (e.g., the first side surface portion 1511 of FIG. 18)disposed in parallel with the folding axis, a second side surfaceportion (e.g., the second side surface portion 1512 of FIG. 18)extending from an end of the first side surface portion in a directioncrossing the folding axis, a third side surface portion (e.g., the thirdside surface portion 1513 of FIG. 18) extending from another end of thefirst side surface portion in parallel with the folding axis, a fourthside surface portion (e.g., the fourth side surface portion 1514 of FIG.18) connected with the third side surface portion and extending from thethird side surface portion in a direction crossing the folding axis, anda fifth side surface portion (e.g., the fifth side surface portion 1515of FIG. 18) connecting the second side surface portion and the fourthside surface portion and extending in parallel with the folding axis,the fifth side surface portion disposed adjacent to the hinge structure,a first slit (e.g., the first slit 1516 a of FIG. 18) formed between anend of the first side surface portion and the second side surfaceportion, a second slit (e.g., the second slit 1516 b of FIG. 18) formedbetween the second side surface portion and the fifth side surfaceportion, a third slit (e.g., the third slit 1516 c of FIG. 18) formedbetween another end of the first side surface portion and the third sidesurface portion, a fourth slit (e.g., the fourth slit 1516 d of FIG. 18)formed between the third side surface portion and the fourth sidesurface portion, and a fifth slit (e.g., the fifth slit 1516 e of FIG.18) formed between the fourth side surface portion and the fifth sidesurface portion, and wherein the third side surface portion and thefourth side surface portion may be formed of the at least one firstradiation conductor, and the first side surface portion, the second sidesurface portion, and the fifth side surface portion may be formed of theat least one second radiation conductor.

According to an embodiment, the second side surface member (e.g., thesecond side surface member 1502 of FIG. 18) may include a sixth sidesurface portion (e.g., the sixth side surface portion 1521 of FIG. 18)disposed in parallel with the folding axis, a seventh side surfaceportion (e.g., the seventh side surface portion 1522 of FIG. 18)extending from an end of the sixth side surface portion in a directioncrossing the folding axis, an eighth side surface portion (e.g., theeighth side surface portion 1523 of FIG. 18) extending from another endof the sixth side surface portion in parallel with the folding axis, aninth side surface portion (e.g., the ninth side surface portion 1524 ofFIG. 18) connected with the eighth side surface portion and extendingfrom the eighth side surface portion in a direction crossing the foldingaxis, and a tenth side surface portion (e.g., the tenth side surfaceportion 1525 of FIG. 18) connecting the seventh side surface portion andthe ninth side surface portion and extending in parallel with thefolding axis, the tenth side surface portion disposed adjacent to thehinge structure, a sixth slit (e.g., the sixth slit 1526 a of FIG. 18)formed between an end of the sixth side surface portion and the seventhside surface portion, a seventh slit (e.g., the seventh slit 1526 b ofFIG. 18) formed between the seventh side surface portion and the tenthside surface portion, an eighth slit (e.g., the eighth slit 1526 c ofFIG. 18) formed between another end of the sixth side surface portionand the eighth side surface portion, a ninth slit (e.g., the ninth slit1526 d of FIG. 18) formed between the eighth side surface portion andthe ninth side surface portion, and a tenth slit (e.g., the tenth slit1526 e of FIG. 18) formed between the ninth side surface portion and thetenth side surface portion, and wherein the eighth side surface portionand the ninth side surface portion may be formed of the at least onethird radiation conductor, and the sixth side surface portion, theseventh side surface portion, and the tenth side surface portion may beformed of the at least one fourth radiation conductor.

According to an embodiment, the at least one first radiation conductorand the at least one third radiation conductor may be formed of a mainantenna, and the at least one second radiation conductor and the atleast one fourth radiation conductor may be formed of a sub antenna.

According to an embodiment, the plurality of first and second connectionmembers include at least one of a coaxial cable, a flexible printedcircuit board (FPCB), a micro strip line, or a strip line.

According to an embodiment, the plurality of first connection membersmay be shorter than the plurality of second connection members (e.g., asshown in FIG. 18, the lengths F1 and F2 of the plurality of firstconnection members may be smaller than the lengths F3 and F4 of theplurality of second connection members).

According to an embodiment, a plurality of third connection members(e.g., the third connection member 1007 of FIG. 20) may be disposed inthe first housing structure to electrically connect the at least onefirst radiation conductor and the at least one second radiationconductor with the switching unit, a plurality of fourth connectionmembers (e.g., the fourth connection member 1008 of FIG. 20) may bedisposed in the second housing structure to electrically connect the atleast one third radiation conductor and the at least one fourthradiation conductor with the switching unit, and a plurality of fifthconnection members (e.g., the fifth connection member 1009 of FIG. 20)may be disposed in at least part of the first and second housingstructures and at least part of the hinge structure to electricallyconnect the plurality of fourth connection members with the switchingunit.

According to an embodiment, the plurality of third and fourth connectionmembers may be formed of a coaxial cable, and the plurality of fifthconnection members may be formed of a flexible printed circuit board(FPCB).

According to an embodiment, the electronic device may further comprise asensor unit (e.g., the sensor unit 1100 of FIG. 18) electricallyconnected with the at least one first to fourth radiation conductor, acommunication module (e.g., the communication module 1200 of FIG. 18)electrically connected with the at least one first to fourth radiationconductor and configured to transmit/receive a wireless signal, theswitching unit (e.g., the switching unit 1300 of FIG. 18) electricallyconnecting the communication module with the at least one first tofourth radiation conductor, and a processor configured to detect, viathe sensor unit, a hand grip on the first housing structure and/or thesecond housing structure in an unfolded state or folded state of thefirst housing structure and the second housing structure and control theswitching unit to switch from the at least one first radiation conductorand the at least one second radiation conductor to the at least onethird radiation conductor and the at least one fourth radiationconductor or from the at least one third radiation conductor and the atleast one fourth radiation conductor to the at least one first radiationconductor and the at least one second radiation conductor.

According to an embodiment, the processor may be configured to detect,via the sensor unit, a hand grip on the first housing structure in theunfolded state and control the switching unit to switch from the atleast one first radiation conductor and the at least one secondradiation conductor to the at least one third radiation conductor andthe at least one fourth radiation conductor.

According to an embodiment, the processor may be configured to detect,via the sensor unit, a hand grip on the second housing structure in theunfolded state and control the switching unit to switch from the atleast one third radiation conductor and the at least one fourthradiation conductor to the at least one first radiation conductor andthe at least one second radiation conductor.

According to an embodiment, the processor may be configured to detect,via the sensor unit, a hand grip on both the first housing structure andthe second housing structure in the unfolded state and control theswitching unit to switch the at least one first radiation conductor andthe at least one second radiation conductor.

According to an embodiment, the processor may be configured to detect,via the sensor unit, a hand grip on both the first housing structure andthe second housing structure in the folded state and control theswitching unit to switch the at least one first radiation conductor andthe at least one second radiation conductor.

While the disclosure has been shown and described with reference tovarious embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the disclosure as definedby the appended claims and their equivalents.

What is claimed is:
 1. A portable communication device comprising: ahousing including a first housing portion and a second housing portionincluding conductive material; a flexible display including a firstdisplay portion accommodated in the first housing portion, and a seconddisplay portion accommodated in the second housing portion, the flexibledisplay foldable about a folding axis when the housing is folded; ahinge structure accommodated in the housing, and connected with thefirst housing portion and the second housing portion; a wirelesscommunication circuit accommodated in the housing, and electricallyconnected with the housing; and a camera module accommodated in thefirst housing portion, wherein the first housing portion includes: afirst side surface portion located opposite to the hinge structure andparallel with the folding axis, a second side surface portion extendedfrom a first end of the first side surface portion and perpendicular tothe folding axis, a third side surface portion extended from a secondend of the first side surface portion and perpendicular to the foldingaxis, a first slit formed in the second side surface portion, a secondslit formed in the second side surface portion, closer to the hingestructure than the first slit, a third slit formed in the first sidesurface portion, a fourth slit formed in the third side surface portion,and a fifth slit formed in the third side surface portion, closer to thehinge structure than the fourth slit, wherein a first length between thethird side surface portion and the third slit is longer than a secondlength between the first side surface portion and the fourth slit,wherein the third slit is disposed closer to the third side surfaceportion than the second side surface portion, and wherein a first partof the first side surface portion and a first part of the third sidesurface portion disposed between the third slit and the fourth slit areconfigured to operate as a first antenna supporting a first frequencyband.
 2. The portable communication device of claim 1, wherein the firstlength is shorter than a third length between the second side surfaceportion and the third slit.
 3. The portable communication device ofclaim 1, wherein a second part of the third side surface portiondisposed between the fourth slit and the fifth slit is configured tooperate as a second antenna supporting a second frequency band at leastpartially different from the first frequency band.
 4. The portablecommunication device of claim 1, wherein the first length is not lessthan 30 mm.
 5. The portable communication device of claim 3, wherein thefirst frequency band is a low frequency band, and wherein the secondfrequency band is a mid/high frequency band.
 6. The portablecommunication device of claim 1, wherein a first part of third sidesurface portion includes a ground terminal, a power supply terminal, anda switch terminal, wherein the ground terminal is provided in the firstpart of the third side surface portion to be electrically connected witha ground portion included in a printed circuit board in a positionadjacent to the fourth slit, wherein the power supply terminal isprovided in the first part of the third side surface portion to beelectrically connected with a power supply portion included in theprinted circuit board between the ground terminal and the switchterminal, and wherein the switch terminal is provided in the first partof the third side surface portion to be electrically connected with aswitch portion included in the printed circuit board in a positionadjacent to the power supply terminal.
 7. The portable communicationdevice of claim 3, wherein the second part of the third side surfaceportion includes a power supply terminal, and wherein the power supplyterminal is provided in the second part of the third side surfaceportion to be electrically connected with a power supply portionincluded in a printed circuit board in a position adjacent to the fourthslit.
 8. The portable communication device of claim 1, wherein thefirst, second, third, fourth, and fifth slits are filled with aninsulating material.
 9. The portable communication device of claim 1,wherein the first housing portion and the second housing portion arerotated on the hinge structure to be folded to allow a first surface toface a third surface or to allow the first surface to be positioned sideby side.
 10. The portable communication device of claim 9, wherein, inthe folded position where the first surface faces the third surface, thefirst, second, third, fourth, and fifth slits of the first housingportion adjacently face a sixth, seventh, eighth, ninth, and tenth slitsof the second housing portion.
 11. The portable communication device ofclaim 10, wherein, in the position where the first surface and the thirdsurface are disposed side by side, the first, second, third, fourth, andfifth slits of the first housing portion are symmetrical with the sixth,seventh, eighth, ninth, and tenth of the second housing portion withrespect to the folding axis.
 12. The portable communication device ofclaim 4, wherein the first length is not more than 50 mm.